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參數(shù)資料
型號(hào)： TF94435H
廠商： DYNEX SEMICONDUCTOR LTD
元件分類： 晶閘管
英文描述： EMI/RFI ENV B/S SZ 12 CAD O/D
中文描述： 1350 A, 3500 V, SCR
封裝： MU169, 4 PIN
文件頁(yè)數(shù)： 7/7頁(yè)
文件大小： 53K
代理商： TF94435H
France, Benelux, Italy and Spain
Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Tel: 07351 827723
Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
UK, Germany, Scandinavia & Rest Of World
Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
Dynex Semiconductor 2000 Publication No. DS4281-4 Issue No.4.0 January 2000HEADQUARTERS OPERATIONSDoddington Road, Lincoln.Tel: 00-44-(0)1522-500500DYNEX POWER INC.Nepean, Ontario, Canada K2E 7W6.Fax: 613.723.1518This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded asthe right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that suchor data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injuryAll brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.e-mail: power_solutions@dynexsemi.comDynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:- This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. The product is in design and development. The datasheet represents the product as it is understood but details may change. The product design is complete and final characterisation for volume production is well in hand. The product parameters are fixed and the product is available to datasheet specification.
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-
loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
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