參數(shù)資料
型號(hào)： THS4500EVM
廠商： Texas Instruments, Inc.
英文描述： THS4500 Evalutation Module(THS4500評(píng)估板)
中文描述： THS4500 Evalutation模塊（THS4500評(píng)估板）
文件頁(yè)數(shù)： 20/25頁(yè)
文件大?。?/td> 313K
代理商： THS4500EVM
4-1
High-Speed Amplifier PCB Layout Tips
High"Speed Amplifier PCB Layout Tips
The THS4500EVM layout has been designed for use with high-speed signals
and can be used as an example when designing PCBs incorporating the
THS4500. Careful attention has been given to component selection,
grounding, power supply bypassing, and signal path layout. Disregarding
these basic design considerations could result in less than optimum
performance of the THS4500 high-speed operational amplifier. Surface-
mount components were selected because of the extremely low lead
inductance associated with this technology. This helps minimize both stray
inductance and capacitance. Also, because surface-mount components are
physically small, the layout can be very compact.
Tantalum power supply bypass capacitors at the power input pads help filter
switching transients from the laboratory power supply. Power supply bypass
capacitors are placed as close as possible to the IC power input pins in order
to minimize the return path impedance. This improves high frequency
bypassing and reduces harmonic distortion. The GND side of these capacitors
should be located close to each other, minimizing the differential current loops
associated with differential output currents. If poor high frequency
performance is observed, replace the 0.1-
μ
F capacitors with microwave
capacitors with a self-resonance at the frequency that produces trouble. A
proper ground plane on both sides of the PCB should be used with high-speed
circuit design. This provides low-inductive ground connections for return
current paths.
In the area of the amplifier input pins, however, the ground plane has been
removed to minimize stray capacitance and reduce ground plane noise
coupling into these pins. This is especially important for the inverting input pin.
As low as 1 pF capacitance at the inverting input can significantly affect the
response of the amplifier or even oscillation.
In general, it is best to keep signal lines as short and as straight as possible.
Incorporation of microstrip or stripline techniques is also recommended when
signal lines are greater than 1 inch in length. These traces must be designed
with a characteristic impedance of either 50
or 75
, as required by the
application. Such a signal line must also be properly terminated with an
appropriate resistor.
Chapter 4
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS4500ID 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
THS4500IDG4 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
THS4500IDGK 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
THS4500IDGKG4 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
THS4500IDGKR 功能描述:特殊用途放大器 High-Speed Fully Differential +/-5 V RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
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