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參數(shù)資料
| 型號： | TLC5618CP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 12.5 us SETTLING TIME, 12-BIT DAC, PDIP8 |
| 封裝： | PLASTIC, DIP-8 |
| 文件頁數(shù)： | 17/26頁 |
| 文件大小： | 386K |
| 代理商： | TLC5618CP |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9955702Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
5962-9955702QPA
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
TLC5618ACD
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618ACDR
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618ACP
OBSOLETE
PDIP
P
8
TBD
Call TI
TLC5618AID
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618AIDR
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618AIP
OBSOLETE
PDIP
P
8
TBD
Call TI
TLC5618AMFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
TLC5618AMJG
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
TLC5618AMJGB
ACTIVE
CDIP
JG
8
1
TBD
A42 SNPB
N / A for Pkg Type
TLC5618AQD
ACTIVE
SOIC
D
8
75
TBD
CU NIPDAU
Level-1-220C-UNLIM
TLC5618AQDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC5618AQDR
ACTIVE
SOIC
D
8
2500
TBD
CU NIPDAU
Level-1-220C-UNLIM
TLC5618AQDRG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC5618CD
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618CDR
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618ID
OBSOLETE
SOIC
D
8
TBD
Call TI
TLC5618IDR
OBSOLETE
SOIC
D
8
TBD
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2007
Addendum-Page 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLC5618AMFK | SERIAL INPUT LOADING, 12.5 us SETTLING TIME, 12-BIT DAC, CQCC20 |
| TLC5618IP | SERIAL INPUT LOADING, 12.5 us SETTLING TIME, 12-BIT DAC, PDIP8 |
| TLC5620CN | SERIAL INPUT LOADING, 10 us SETTLING TIME, 8-BIT DAC, PDIP14 |
| TLC5620CDR | SERIAL INPUT LOADING, 10 us SETTLING TIME, 8-BIT DAC, PDSO14 |
| TLC5620IDR | SERIAL INPUT LOADING, 10 us SETTLING TIME, 8-BIT DAC, PDSO14 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLC5618ID | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLC5618IDR | 制造商:TI 制造商全稱:Texas Instruments 功能描述:PROGRAMMABLE DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTERS |
| TLC5618IP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:PROGRAMMABLE DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTERS |
| TLC5620 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTERS |
| TLC5620C | 制造商:TI 制造商全稱:Texas Instruments 功能描述:QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTERS |
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