參數(shù)資料
型號(hào)： TLV320AIC24I
廠商： Texas Instruments, Inc.
英文描述： Layout and Grounding Guidelines for TLV320AIC2x
中文描述： 為T(mén)LV320AIC2x布局和接地指南
文件頁(yè)數(shù)： 38/46頁(yè)
文件大?。?/td> 452K
代理商： TLV320AIC24I
SLAS428 AUGUST 2004
www.ti.com
38
LAYOUT
The following layout suggestions should provide optimum performance from the ’DAC26. However, many portable
applications have conflicting requirements concerning power, cost, size, and weight. In general, most portable devices
have fairly
clean
power and grounds because most of the internal components are very low power. This situation means
less bypassing for the converter power and less concern regarding grounding. Still, each situation is unique and the
following suggestions should be reviewed carefully.
For optimum performance, care must be taken with the physical layout of the ’DAC26 circuitry. Power to the ’DAC26 must
be clean and well bypassed. A 0.1-
μ
F ceramic bypass capacitor must be placed as close to the device as possible. A 1-
μ
F
to 10-
μ
F capacitor may also be needed if the impedance between the ’DAC26 supply pins and the system power supply
is high.
The ground pins must be connected to a clean ground point. In many cases, this is the
analog
ground. Avoid connections
which are too near the grounding point of a microcontroller or digital signal processor. If needed, run a ground trace directly
from the converter to the power supply entry or battery connection point. The ideal layout includes an analog ground plane
dedicated to the converter and associated analog circuitry.
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