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參數(shù)資料
| 型號： | TLV5638QDREP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO8 |
| 封裝： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件頁數(shù)： | 8/21頁 |
| 文件大?。?/td> | 523K |
| 代理商： | TLV5638QDREP |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLV5638MDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5638QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03628-01XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03628-02XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV5638-EP :
Catalog: TLV5638
Military: TLV5638M
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Addendum-Page 1
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| TLV5638MDREP | SERIAL INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO8 |
| TLV5639CDWRG4 | PARALLEL, WORD INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO20 |
| TLV5639IDWRG4 | PARALLEL, WORD INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO20 |
| TLV5639CPWRG4 | PARALLEL, WORD INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO20 |
| TLV5639IPW | PARALLEL, WORD INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO20 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV5638QDRG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12B 1 or 3.5 us DAC Serial Inp Dual DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5639 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN |
| TLV5639C | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN |
| TLV5639CDW | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12bit DAC w/V Ref RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5639CDWG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12bit DAC w/V Ref RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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