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參數(shù)資料
| 型號： | TLV571IPWR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| 封裝： | GREEN, PLASTIC, TSSOP-24 |
| 文件頁數(shù)： | 18/28頁 |
| 文件大小： | 479K |
| 代理商： | TLV571IPWR |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLV571IDW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV571IDWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV571IPW
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV571IPWG4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
19-May-2010
Addendum-Page 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLV571IDWG4 | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV571IDW | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV571IPWG4 | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV571IPW | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV571PW | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER |
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| TLV5734PAG | 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 8B 30MSPS ADC Triple Ch Digital Clamp RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TLV5734PAGG4 | 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 8B 30 MSPS ADC 3Ch RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
| TLV6001IDBVR | 功能描述:IC OP AMP RR 1MHZ SOT23-5 制造商:texas instruments 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 放大器類型:通用 電路數(shù):1 輸出類型:滿擺幅 壓擺率:0.5 V/μs 增益帶寬積:1MHz 電流 - 輸入偏置:1pA 電壓 - 輸入失調(diào):750μV 電流 - 電源:75μA 電壓 - 電源，單/雙（±）:1.8 V ~ 5.5 V，±0.9 V ~ 2.75 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SC-74A，SOT-753 供應(yīng)商器件封裝:SOT-23-5 標(biāo)準(zhǔn)包裝:1 |
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