參數(shù)資料
型號: TMS320C6415TBZLZA8
廠商: Texas Instruments
文件頁數(shù): 107/146頁
文件大?。?/td> 0K
描述: IC FIXED-POINT DSP 532-FCBGA
標(biāo)準(zhǔn)包裝: 60
系列: TMS320C6414T/15T/16T
類型: 定點
接口: 主機(jī)接口,McBSP,PCI,UTOPIA
時鐘速率: 850MHz
非易失內(nèi)存: 外部
芯片上RAM: 1.03MB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.20V
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 532-BFBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 532-FCBGA(23x23)
包裝: 托盤
配用: TMDXEVM6452-ND - TMDXEVM6452
296-23038-ND - DSP STARTER KIT FOR TMS320C6416
TMS320C6414T, TMS320C6415T, TMS320C6416T
FIXEDPOINT DIGITAL SIGNAL PROCESSORS
SPRS226M NOVEMBER 2003 REVISED APRIL 2009
63
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
device support
device and development-support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS.
(e.g., TMS320C6415TGLZ7) Texas Instruments recommends two of three possible prefix designators for its
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX / TMDX) through fully qualified production devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device’s electrical
specifications
TMP
Final silicon die that conforms to the device’s electrical specifications but has not completed
quality and reliability verification
TMS
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal qualification
testing
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, GLZ), the temperature range (for example, “blank” is the default commercial temperature range),
and the device speed range in megahertz (for example, 7 is 720-MHz). Figure 5 provides a legend for reading
the complete device name for any TMS320C64x
DSP generation member.
The ZLZ package, like the GLZ package, is a 532-ball plastic BGA only with Pb-free balls. The CLZ is the
PbFree die bump and solder ball version of GLZ and ZLZ. For device part numbers and further ordering
information for TMS320C6414T/TMS320C6415T/TMS320C6416T in the GLZ, ZLZ and CLZ package types,
see the TI website (http://www.ti.com) or contact your TI sales representative.
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