參數(shù)資料
型號: TPS24711DGSR
廠商: TEXAS INSTRUMENTS INC
元件分類: 電源管理
英文描述: POWER SUPPLY SUPPORT CKT, PDSO10
封裝: GREEN, PLASTIC, MSOP-10
文件頁數(shù): 12/34頁
文件大?。?/td> 2148K
代理商: TPS24711DGSR
SLVSAL2C
– JANUARY 2011 – REVISED MAY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION
TA
PACKAGE
PART NUMBER(1)
FUNCTION
FLT, PG POLARITY
MARKING
TPS24710
Latched
24710
Active Low
TPS24711
Retry
24711
–40C to 85C
MSOP-10
TPS24712
Latched
24712
Active High
TPS24713
Retry
24713
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range, all voltages referred to GND (unless otherwise noted)
VALUE
UNIT
EN, FLT(1)(2), FLTb(1)(3), GATE, OUT, PG(1)(2), PGb(1)(3), SENSE, VCC
–0.3 to 30
PROG(1)
–0.3 to 0.3
Input voltage range
V
SENSE to VCC
–0.3 to 0.3
TIMER
–0.3 to 5
Sink current
FLT, PG, FLTb, PGb
5
mA
Source current
PROG
Internally limited
All pins except PG and PGb
2
Human-body model
ESD rating
PG, PGb
0.5
kV
Charged-device model
0.5
Temperature
Maximum junction, TJ
Internally limited
°C
(1)
Do not apply voltages directly to these pins.
(2)
for TPS24712/13
(3)
for TPS24710/11
THERMAL INFORMATION
TPS24710/11/12/13
THERMAL METRIC(1)
UNIT
MSOP (10) PINS
θJA
Junction-to-ambient thermal resistance
166.5
°C/W
θJCtop
Junction-to-case (top) thermal resistance
41.8
°C/W
θJB
Junction-to-board thermal resistance
86.1
°C/W
ψJT
Junction-to-top characterization parameter
1.5
°C/W
ψJB
Junction-to-board characterization parameter
84.7
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s): TPS24710 TPS24711 TPS24712 TPS24713
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