參數資料
型號: TPS40055MPWPREPG4
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16
封裝: PLASTIC, HTSSOP-16
文件頁數: 13/35頁
文件大?。?/td> 2348K
代理商: TPS40055MPWPREPG4
SGLS310B – JULY 2005 – REVISED OCTOBER 2010
www.ti.com
The QRR is not always described in a MOSFET's data sheet, but may be obtained from the MOSFET vendor.
The total synchronous rectifier MOSFET power dissipation is described in Equation 39.
(39)
TPS40055 POWER DISSIPATION
The power dissipation in the TPS40055 is largely dependent on the MOSFET driver currents and the input
voltage. The driver current is proportional to the total gate charge, Qg, of the external MOSFETs. Driver power
(neglecting external gate resistance)[2] can be calculated from Equation 40.
(40)
And the total power dissipation in the TPS40055, assuming the same MOSFET is selected for both the high-side
and synchronous rectifier is described in Equation 41.
(41)
or
(42)
where:
IQ is the quiescent operating current (neglecting drivers)
The maximum power capability of the device's PowerPad package is dependent on the layout as well as air flow.
The thermal impedance from junction to air, assuming 2 oz. copper trace and thermal pad with solder and no air
flow.
(43)
The maximum allowable package power dissipation is related to ambient temperature by Equation 44.
(44)
Substituting Equation 45 into Equation 41 and solving for fSW yields the maximum operating frequency for the
TPS40055. The result is described in Equation 45.
(45)
LAYOUT CONSIDERATIONS
PowerPAD PACKAGE
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. For
maximum thermal performance, the circuit board must have an area of solder-tinned-copper underneath the
package. The dimensions of this area depends on the size of the PowerPAD package. For a 16-pin TSSOP
(PWP) package, dimensions of the circuit board pad area are 5 mm x 3,4 mm [2]. The dimensions of the package
pad are shown in Figure 16.
Thermal vias connect this area to internal or external copper planes and should have a drill diameter sufficiently
small so that the via hole is effectively plugged when the barrel of the via is plated with copper. This plug is
20
Copyright 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS40055-EP
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相關代理商/技術參數
參數描述
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TPS40055PWPG4 功能描述:DC/DC 開關控制器 Wide Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK
TPS40055PWPR 功能描述:DC/DC 開關控制器 Wide Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK
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TPS40056 制造商:TI 制造商全稱:Texas Instruments 功能描述:WIDE-INPUT SYNCHRONOUS, TRACKING BUCK CONTROLLER