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參數(shù)資料
| 型號： | TQ5135 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 20/22頁 |
| 文件大小： | 261K |
| 代理商： | TQ5135 |
TQ5135
Data Sheet
20
For additional information and latest specifications, see our website:
www.triquint.com
Package Pinout:
GND
GND
RF In
GND
LNA
Bias
MXR In
IF Out
GIC
GND
LO
In
GND/LNA
Gain
LNA Out
LO
Vdd
N/C
LNA Vdd
LNA
Mode
Mixer
IF Amp
LO Buffer
1
active
bias
logic
LNA
Pin Descriptions:
Pin #
1
Pin Name
LNA GND2
Description and Usage
Ground connection. Connect as closely as possible to ground or to package paddle ground.
2
LNA IN
Connected to external RF input matching network. Interface is DC blocked.
3
Not Connected
Open connection. No connection is necessary.
4
LNA BIAS
Connected to external LNA bias resistor.
5
LNA VDD
Connected to external LNA supply voltage and RF bypass capacitor. RF bypass capacitor should be as
close as possible to IC.
6
LNA GND1
Ground connection. Connect as closely as possible to ground or to package paddle ground.
7
IF
Connected to external IF matching network and IF supply voltage.
8
IF BIAS
Connected to external IF source degeneration resistor and RF bypass capacitor.
9
LO IN
Connected to LO input signal. Interface is DC blocked.
10
LO VDD
Connected to external series LC network for LO drain tuning. Network should be as close to IC as possible
with good grounding of capacitor.
11
LO GND
Ground connection. Connect as closely as possible to ground or to package paddle ground.
12
MXR IN
Connected to external mxer matching network. Connect image reject filter as closely to this pin as possible
(~0.1in). Interface is DC blocked.
13
Not Connected
Open connection. No connection is necessary.
14
LNA OUT
Connected to external image reject filter. Interface is DC blocked.
15
LNA MODE
Connected to external mode control signal.
16
LNA SOURCE
Connected to LNA’s external source degeneration inductance (realized with PCB trace). Inductance can
vary between 0 and 1 nH.
Paddle
GND
Ground connection. It is very important to place multiple via holes under the paddle. Provides RF
grounding for the part.
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