參數(shù)資料
型號(hào)： TSA5059
廠商： NXP Semiconductors N.V.
英文描述： 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
中文描述： 2.7千兆赫的I2C控制的低相位噪聲頻率合成器總線
文件頁(yè)數(shù)： 21/24頁(yè)
文件大?。?/td> 151K
代理商： TSA5059
1999 Oct 05
21
Philips Semiconductors
Preliminary specification
2.7 GHz I
2
C-bus controlled low phase
noise frequency synthesizer
TSA5059
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
TSA5059T 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSC2200 PDA ANALOG INTERFACE CIRCUIT
TSC2200IPW PDA ANALOG INTERFACE CIRCUIT
TSC2200IPWR PDA ANALOG INTERFACE CIRCUIT
TSC2200IRHB PDA ANALOG INTERFACE CIRCUIT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TSA5059A 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059AT 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059AT/C2,518 制造商:NXP Semiconductors 功能描述:
TSA5059ATS 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059ATS/C1,118 功能描述:鎖相環(huán) - PLL 2,7GHZI2C BUS RoHS:否 制造商:Silicon Labs 類(lèi)型:PLL Clock Multiplier 電路數(shù)量:1 最大輸入頻率:710 MHz 最小輸入頻率:0.002 MHz 輸出頻率范圍:0.002 MHz to 808 MHz 電源電壓-最大:3.63 V 電源電壓-最小:1.71 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:QFN-36 封裝:Tray
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*