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參數(shù)資料
| 型號： | TSC2111IRGZTG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 0.4 W, 1 CHANNEL, AUDIO AMPLIFIER, QCC48 |
| 封裝： | PLASTIC, QFN-48 |
| 文件頁數(shù)： | 34/99頁 |
| 文件大?。?/td> | 1143K |
| 代理商： | TSC2111IRGZTG4 |
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TSC2111
SLAS495A JUNE 2006 REVISED OCTOBER 2007
www.ti.com
4
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1), (2)
UNITS
AVDD1/2 to AVSS1/2
0.3 V to 3.9 V
DRVDD to DRVSS1/2
0.3 V to 3.9 V
BVDD to DRVSS1/2
0.3 V to 4.5 V
IOVDD to DVSS
0.3 V to 3.9 V
Digital input voltage to DVSS
0.3 V to IOVDD + 0.3 V
Analog input (except VBAT) voltage to AVSS1/2
0.3 V to AVDD + 0.3 V
VBAT input voltage to AVSS1/2
0.3 V to 6 V
AVSS1/2 to DRVSS1/2 to DVSS
0.1 V to 0.1 V
AVDD1/2 to DRVDD
0.1 V to 0.1 V
Operating temperature range
40
°C to 85°C
Storage temperature range
65
°C to 105°C
Junction temperature (TJ Max)
105
°C
QFN package
Power dissipation
(TJ Max TA)/θJA
QFN package
θJA Thermal impedance (with thermal pad soldered to board)
27
°C/W
Lead temperature
Infrared (15 sec)
240
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If the TSC2111 is used to drive high power levels to an 8- load for extended intervals at an ambient temperature above 80°C, multiple vias should
be used to electrically and thermally connect the thermal pad on the QFN package to an internal heat dissipating ground plane on the user’s PCB.
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