參數(shù)資料
型號(hào): UPA2791GR
廠商: NEC Corp.
英文描述: MOS FIELD EFFECT TRANSISTOR SWITCHING N- AND P-CHANNEL POWER MOS FET
中文描述: MOS場(chǎng)效應(yīng)晶體管的開(kāi)關(guān)N溝道和P溝道功率場(chǎng)效應(yīng)晶體管
文件頁(yè)數(shù): 11/12頁(yè)
文件大?。?/td> 245K
代理商: UPA2791GR
Data Sheet G18207EJ2V0DS
11
μ
PA2791GR
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
E2 TYPE
E1 TYPE
Reel side
Draw-out side
MARKING INFORMATION
A2791
Pb-free plating marking
Lot code
1 pin mark
RECOMMENDED SOLDERING CONDITIONS
The
μ
PA2791GR should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Maximum temperature (Package's surface temperature): 260
°
C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220
°
C: 60 seconds or less
Preheating time at 160 to 180
°
C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
IR60-00-3
Partial heating
Maximum temperature (Pin temperature): 350
°
C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
P350
Caution Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料
PDF描述
UPA2791GR-E1-AT MOS FIELD EFFECT TRANSISTOR SWITCHING N- AND P-CHANNEL POWER MOS FET
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