參數資料
型號: UPD72873
廠商: NEC Corp.
英文描述: MOS INTEGRATED CIRCUIT
中文描述: 馬鞍山集成電路
文件頁數: 7/40頁
文件大?。?/td> 269K
代理商: UPD72873
Preliminary Data Sheet S15305EJ2V0DS
7
μ
PD72873
4. PHY FUNCTION.................................................................................................................................... 29
4.1 Cable Interface............................................................................................................................... 29
4.1.1 Connections .........................................................................................................................................29
4.1.2 Cable Interface Circuit..........................................................................................................................30
4.1.3 CPS......................................................................................................................................................30
4.1.4 Unused Ports........................................................................................................................................30
4.2 PLL and Crystal Oscillation Circuit ............................................................................................. 30
4.2.1 Crystal Oscillation Circuit .....................................................................................................................30
4.2.2 PLL.......................................................................................................................................................30
4.3 PC0 to PC2 ..................................................................................................................................... 30
4.4 P_RESET ........................................................................................................................................ 30
4.5 RI0, RI1 ........................................................................................................................................... 30
5. ELECTRICAL SPECIFICATIONS......................................................................................................... 31
6. PACKAGE DRAWING.......................................................................................................................... 34
7. RECOMMENDED SOLDERING CONDITIONS................................................................................... 35
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