參數(shù)資料
型號(hào)： UPD75208CW
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述： 4位單片機(jī)
文件頁(yè)數(shù)： 57/62頁(yè)
文件大小： 497K
代理商： UPD75208CW
57
μ
PD75208
Recommended
Condition Symbol
Soldering Method
Soldiering Conditions
Solder bath temperature: 260
°
C or less, Duration: 10 sec. max.
Number of times: Once, Time limit: 7 days
*
(thereafter 10 hours prebaking required
at 125
°
C)
Preheating temperature : 120
°
C max. (package surface temperature)
Package peak temperature: 230
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Once, Time limit: 7 days
*
(thereafter 10 hours prebaking required
at 125
°
C)
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Once, Time limit: 7 days
*
(thereafter 10 hours prebaking required
at 125
°
C)
Pin part temperature: 300
°
C or below , Duration: 3 sec. max. (per device side)
Pin part heating
VPS
Infrared reflow
Wave soldering
–––
VP15-107-1
IR30-107-1
WS60-107-1
Table 15-2 Insertion Type Soldering Conditions
μ
PD75208CW-
×××
: 64-pin plastic shrink DIP (750 mil)
μ
PD75208GF-
×××
-3BE : 64-pin plastic QFP (body 14
×
20 mm)
Soldering Method
Soldering Conditions
Wave soldering
(lead part only)
Solder bath temperature: 260
°
C or below , Duration: 10 sec. max.
Pin part temperature: 260
°
C or below , Duration: 10 sec. max.
Pin part heating
Note
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
#
15. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
“Semiconductor Device Mount Technology” (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 15-1 Surface Mounting Type Conditions
*
For the storage period after dry-pack decompression storage conditions are max. 25
°
C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
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