參數(shù)資料
型號(hào)： UPD75512A
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述： 4位單片機(jī)
文件頁數(shù)： 58/64頁
文件大?。?/td> 494K
代理商： UPD75512A
μ
PD75512(A)
58
12. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75512(A) be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
Devices Mounting Manual" (IEI-616).
For other soldering methods and conditions, consult NEC.
Table 12-1 Soldering Conditions of Surface Mount Type
μ
PD75512GF(A)-xxx-3B9: 80-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Symbol for Recommended
Condition
IR30-00-1
Infrared Reflow
Package peak temperature: 230
°
C,
time: 30 seconds max. (210
°
C min.),
number of times: 1
Package peak temperature: 215
°
C,
time: 40 seconds max. (200
°
C min.),
number of times: 1
Soldering bath temperature: 260
°
C max.,
time: 10 seconds max., number of times: 1,
pre-heating temperature: 120
°
C max. (package surface
temperature)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
VPS
VP15-00-1
Wave Soldering
WS60-00-1
Pin Partial Heating
—
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
method).
A model that can be soldered under the more stringent conditions (infrared reflow peak
temperature: 235
°
C, number of times: 2, and an extended number of days) is also available.
For details, consult NEC.
Notice
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