9
μ
PD77015, 77017, 77018
CONTENTS
1.
PIN FUNCTIONS............................................................................................................................... 10
1.1
Pin Functions........................................................................................................................................... 10
1.2
Recommended Connection for Unused Pins ....................................................................................... 15
2.
FUNCTIONS...................................................................................................................................... 16
2.1
Pipeline Processing ................................................................................................................................ 16
2.1.1
Outline ........................................................................................................................................... 16
2.1.2
Instructions with Delay .................................................................................................................. 16
2.2
Program Control Unit.............................................................................................................................. 17
2.3
Operation Unit ......................................................................................................................................... 17
2.3.1
General register (R0 to R7) ........................................................................................................... 17
2.3.2
MAC: Multiply ACcumulator ......................................................................................................... 18
2.3.3
ALU: Arithmetic Logic Unit ........................................................................................................... 18
2.3.4
BSFT: Barrel ShiFTer................................................................................................................... 18
2.3.5
SAC: Shifter And Count Circuit .................................................................................................... 18
2.3.6
CJC: Condition Judge Circuit ....................................................................................................... 19
2.4
Memory..................................................................................................................................................... 19
2.4.1
Instruction RAM Outline ................................................................................................................ 20
2.4.2
Data Memory Outline .................................................................................................................... 21
2.4.3
Data Memory Addressing.............................................................................................................. 22
2.5
On-chip Peripheral Circuit...................................................................................................................... 22
2.5.1
Serial Interface Outline.................................................................................................................. 22
2.5.2
Host Interface Outline.................................................................................................................... 22
2.5.3
General Input/output Ports Outline................................................................................................ 22
2.5.4
Wait Cycle Register....................................................................................................................... 22
3.
INSTRUCTIONS................................................................................................................................ 23
3.1
Outline ...................................................................................................................................................... 23
3.2
Instruction Set and Operation................................................................................................................ 24
4.
ELECTRICAL SPECIFICATIONS..................................................................................................... 32
5.
PACKAGE DRAWING ...................................................................................................................... 53
6.
RECOMMENDED SOLDERING CONDITIONS................................................................................ 54