參數(shù)資料
型號(hào)： UPD780021AY
廠商： NEC Corp.
元件分類： 8位微控制器
英文描述： 8-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述： 8位單晶片微控制器
文件頁(yè)數(shù)： 75/90頁(yè)
文件大?。?/td> 660K
代理商： UPD780021AY
μ
PD78F0034B, 78F0034BY, 78F0034B(A), 78F0034BY(A)
75
Data Sheet U16369EJ1V0DS
11. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78F0034B, 78F0034BY, 78F0034B(A), and 78F0034BY(A) should be soldered and mounted under
the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 11-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78F0034BGB-8EU:
μ
PD78F0034BGB(A)-8EU:
μ
PD78F0034BYGB-8EU:
μ
PD78F0034BYGB(A)-8EU: 64-pin plastic LQFP (10 x 10)
64-pin plastic LQFP (10 x 10)
64-pin plastic LQFP (10 x 10)
64-pin plastic LQFP (10 x 10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2)
μ
PD78F0034BGC-8BS:
μ
PD78F0034BGC(A)-8BS:
μ
PD78F0034BYGC-8BS:
μ
PD78F0034BYGC(A)-8BS: 64-pin plastic LQFP (14 x 14)
64-pin plastic LQFP (14 x 14)
64-pin plastic LQFP (14 x 14)
64-pin plastic LQFP (14 x 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
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