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參數(shù)資料
| 型號： | UPD780021AY |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁數(shù)： | 76/90頁 |
| 文件大?。?/td> | 660K |
| 代理商： | UPD780021AY |
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μ
PD78F0034B, 78F0034BY, 78F0034B(A), 78F0034BY(A)
76
Data Sheet U16369EJ1V0DS
Table 11-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
μ
PD78F0034BGK-9ET:
μ
PD78F0034BGK(A)-9ET:
μ
PD78F0034BYGK-9ET:
μ
PD78F0034BYGK(A)-9ET: 64-pin plastic TQFP (12 x 12)
64-pin plastic TQFP (12 x 12)
64-pin plastic TQFP (12 x 12)
64-pin plastic TQFP (12 x 12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: Once, Preheating temperature: 120
°
C max. (package surface temperature),
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
WS60-107-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(4)
μ
PD78F0034BF1-CN3:
μ
PD78F0034BYF1-CN3: 73-pin plastic FBGA (9 x 9)
73-pin plastic FBGA (9 x 9)
Soldering Method
Soldering Conditions
Recommended
ConditionSymbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 60 seconds max. (at 220
°
C or higher),
Count: Three times or less,
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 20 hours)
IR60-203-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Three times or less,
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 20 hours)
VP15-203-3
Note
After opening the dry pack, store it at 25
°
C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD780023AGB-G43-8EU-X3-A | 制造商:Renesas Electronics Corporation 功能描述: |
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| UPD780023AGK-C74-9ET-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780024AGK-C42-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
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