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參數(shù)資料
| 型號： | UPD780024AGB-xxx-8EU |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁數(shù)： | 85/96頁 |
| 文件大小： | 661K |
| 代理商： | UPD780024AGB-XXX-8EU |
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85
μ
PD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY
Data Sheet U14042EJ4V0DS
Table 14-1. Surface Mounting Type Soldering Conditions (3/3)
(4)
μ
PD780021AGB-
μ
PD780022AGB-
μ
PD780023AGB-
μ
PD780024AGB-
μ
PD780021AYGB-
μ
PD780022AYGB-
μ
PD780023AYGB-
μ
PD780024AYGB-
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
×××
-8EU: 64-pin plastic LQFP (10 x 10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-00-2
(at 210
°
C or higher), Count: Twice or less
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-00-2
(at 200
°
C or higher), Count: Twice or less
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
––
Caution Do not use different soldering methods together (except for partial heating).
(5)
μ
PD780021AF1-
μ
PD780022AF1-
μ
PD780023AF1-
μ
PD780024AF1-
μ
PD780021AYF1-
μ
PD780022AYF1-
×××
μ
PD780023AYF1-
μ
PD780024AYF1-
×××
×××
-CN3: 73-pin plastic FBGA (9 x 9)
×××
-CN3: 73-pin plastic FBGA (9 x 9)
×××
-CN3: 73-pin plastic FBGA (9 x 9)
×××
-CN3: 73-pin plastic FBGA (9 x 9)
×××
-CN3: 73-pin plastic FBGA (9 x 9)
-CN3: 73-pin plastic FBGA (9 x 9)
×××
-CN3: 73-pin plastic FBGA (9 x 9)
-CN3: 73-pin plastic FBGA (9 x 9)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 60 seconds max.
IR60-203-3
(at 220
°
C or higher), Count: Three times or less,
Exposure limit:
3 days
Note
(after that, prebake at 125
°
C for 20 hours)
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-203-3
(at 200
°
C or higher), Count: Three times or less,
Exposure limit:
3 days
Note
(after that, prebake at 125
°
C for 20 hours)
Note
After opening the dry pack, store it at 25
°
C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD780024ACW-xxx | Circular Connector; No. of Contacts:55; Series:JTP02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle |
| UPD780024AF1-xxx-CN3 | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780024AGC-xxx-8BS | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780024AGC-xxx-AB8 | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD780024AGK-xxx-9ET | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD780024AGK-C42-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780024AGK-C93-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780033AGK-B03-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780033AGK-B03-9ET-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780034AGC-119-8BS-A | 制造商:Renesas Electronics Corporation 功能描述:NECUPD780034AGC-119-8BS-A MCU |
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