參數(shù)資料
型號: W25X32-VSSI-Z
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 32M X 1 FLASH 2.7V PROM, PDSO8
封裝: 0.208 INCH, ROHS COMPLIANT, SOIC-8
文件頁數(shù): 8/47頁
文件大?。?/td> 1317K
代理商: W25X32-VSSI-Z
W25X16, W25X32, W25X64
- 16 -
11.2 INSTRUCTIONS
The instruction set of the W25X16/32/64 consists of fifteen basic instructions that are fully controlled
through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked into the DIO input provides the instruction code. Data on
the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 19. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a
full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects
the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or
when the Status Register is being written, all instructions except for Read Status Register will be
ignored until the program or erase cycle has completed.
11.2.1 Manufacturer and Device Identification
MANUFACTURER ID
(M7-M0)
Winbond Serial Flash
EFH
Device ID
(ID7-ID0)
(ID15-ID0)
Instruction
ABh, 90h
9Fh
W25X16
14h
3015h
W25X32
15h
3016h
W25X64
16h
3017h
相關(guān)PDF資料
PDF描述
WF1024K32E-150H2M 4M X 8 FLASH 12V PROM MODULE, 150 ns, CHIP66
WS128K48-20G4WMA 768K X 8 MULTI DEVICE SRAM MODULE, 20 ns, CQFP116
WSF512K32-39G2TMA SPECIALTY MEMORY CIRCUIT, CQFP68
WS512K16-35DLIA 512K X 16 MULTI DEVICE SRAM MODULE, 35 ns, CDMA44
WS512K8-35CQ 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, DMA32
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25X32VZEI 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X32VZEIG 功能描述:IC FLASH 32MBIT 75MHZ 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M(8Mx32) 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2
W25X32VZEIG T&R 功能描述:IC FLASH 32MBIT 75MHZ 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M(8Mx32) 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:帶卷 (TR) 其它名稱:557-1327-2
W25X32VZEIZ 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X32VZPI 制造商:WINBOND 制造商全稱:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI