參數(shù)資料
型號： W25X40BLSNIG
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 4M X 1 FLASH 2.7V PROM, PDSO8
封裝： 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù)： 46/53頁
文件大?。?/td> 2041K
代理商： W25X40BLSNIG
W25X10BL/20BL/40BL
- 50 -
8-Pad WSON 6x5mm Cont’d.
SYMBOL
MILLIMETERS
INCHES
MIN
TYP.
MAX
MIN
TYP.
MAX
SOLDER PATTERN
M
3.40
0.1338
N
4.30
0.1692
P
6.00
0.2360
Q
0.50
0.0196
R
0.75
0.0255
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25X40BLSSIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
W25X40BLSVIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:2.5V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
W25X40BLUXIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:2.5V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
W25X40BLZPIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
W25X40BV 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
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