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參數(shù)資料
| 型號(hào)： | W3E32M64S-333BC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.7 ns, PBGA219 |
| 封裝： | 25 X 25 MM, PLASTIC, BGA-219 |
| 文件頁(yè)數(shù)： | 8/17頁(yè) |
| 文件大小： | 847K |
| 代理商： | W3E32M64S-333BC |
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W3E32M64S-XBX
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2007
Rev. 4
ORDERING INFORMATION
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 64
2.5V Power Supply
DATA RATE (Mbs):
200 = 100MHz/200Mbs
250 = 125MHz/250Mbs
266 = 133MHz/266Mbs
333 = 166MHz/333Mbs
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA), 25mm x 25mm
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 32M 64 S - XXX B X
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Bottom View
1 234 56 789 10 11 12 13 14 15 16
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
219 x
0.762 (0.030) NOM
1.27 (0.050)
NOM
25.1 (0.988) MAX
19.05 (0.750) NOM
25.1 (0.988)
MAX
19.05 (0.750)
NOM
2.03 (0.080)
MAX
0.61
(0.024)
NOM
Note: This package utlizes solderballs which contain lead: Sn63Pb37
If you require lead free solder ball packages, please contack WEDC for information
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PDF描述 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3E32M64S-333BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 333 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64S-333BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 333 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64S-333SBC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 333 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64S-333SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 333 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64S-333SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 333 MHZ, 208 PBGA, MIL-TEMP. - Bulk |
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