參數(shù)資料
型號(hào): WEDPNF8M722V-1210BI
廠(chǎng)商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類(lèi): 存儲(chǔ)器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA275
封裝: 32 X 25 MM, PLASTIC, BGA-275
文件頁(yè)數(shù): 28/43頁(yè)
文件大?。?/td> 1280K
代理商: WEDPNF8M722V-1210BI
34
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
White Electronic Designs
WEDPNF8M722V-XBX
FLASH AC WAVEFORMS FOR DATA POLLING DURING EMBEDDED ALGORITHM OPERATIONS
FIG. 14
相關(guān)PDF資料
PDF描述
WEDPNF8M722V-1010BC SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M722V-1210BM SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M722V-1015BC SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M722V-1212BM SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M722V-1012BC SPECIALTY MEMORY CIRCUIT, PBGA275
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WEDPNF8M722V-1210BM 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1212BC 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1212BI 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1212BM 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1215BC 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package