參數(shù)資料
型號: XC2S150-6FG256C
廠商: Xilinx Inc
文件頁數(shù): 73/99頁
文件大?。?/td> 0K
描述: IC FPGA 2.5V C-TEMP 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-II
LAB/CLB數(shù): 864
邏輯元件/單元數(shù): 3888
RAM 位總計: 49152
輸入/輸出數(shù): 176
門數(shù): 150000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FBGA(17x17)
Spartan-II FPGA Family: Pinout Tables
DS001-4 (v2.8) June 13, 2008
Module 4 of 4
Product Specification
75
R
I/O
4
---
P87
295
I/O
4
---
P88
298
I/O
4
-
P84
K8
P89
301
I/O
4
-
P83
N9
P90
304
VCCINT
-P42
P82
M9
P91
-
VCCO
4
---
P92
-
GND
-
P81
L9
P93
-
I/O
4
P43
P80
K9
P94
307
I/O
4
P44
P79
N10
P95
310
I/O
4
-
P78
M10
P96
313
I/O, VREF
4
P45
P77
L10
P98
316
I/O
4
---
P99
319
I/O
4
-
P76
N11
P100
322
I/O
4
P46
P75
M11
P101
325
I/O
4
P47
P74
L11
P102
328
GND
-
P48
P73
N12
P103
-
DONE
3
P49
P72
M12
P104
331
VCCO
4
P50
P71
N13
P105
-
VCCO
3
P50
P70
M13
P105
-
PROGRAM
-
P51
P69
L12
P106
334
I/O (INIT)
3
P52
P68
L13
P107
335
I/O (D7)
3
P53
P67
K10
P108
338
I/O
3
-
P66
K11
P109
341
I/O
3
---
P110
344
I/O, VREF
3
P54
P65
K12
P111
347
I/O
3
-
P64
K13
P113
350
I/O
3
P55
P63
J10
P114
353
I/O (D6)
3
P56
P62
J11
P115
356
GND
-
P61
J12
P116
-
VCCO
3
---
P117
-
I/O (D5)
3
P57
P60
J13
P119
359
I/O
3
P58
P59
H10
P120
362
I/O
3
---
P121
365
I/O
3
---
P122
368
I/O
3
---
P123
371
GND
-
---
P124
-
I/O, VREF
3
P59
P58
H11
P125
374
I/O (D4)
3
P60
P57
H12
P126
377
I/O
3
-
P56
H13
P127
380
VCCINT
-
P61
P55
G12
P128
-
I/O, TRDY(1)
3
P62
P54
G13
P129
386
XC2S30 Device Pinouts (Continued)
XC2S30 Pad Name
VQ100 TQ144 CS144 PQ208
Bndry
Scan
Function
Bank
VCCO
3
P63
P53
G11
P130
-
VCCO
2
P63
P53
G11
P130
-
GND
-
P64
P52
G10
P131
-
I/O, IRDY(1)
2
P65
P51
F13
P132
389
I/O
2
-
P133
392
I/O
2
-
P50
F12
P134
395
I/O (D3)
2
P66
P49
F11
P135
398
I/O, VREF
2
P67
P48
F10
P136
401
GND
-
---
P137
-
I/O
2
-
P138
404
I/O
2
-
P139
407
I/O
2
-
P140
410
I/O
2
P68
P47
E13
P141
413
I/O (D2)
2
P69
P46
E12
P142
416
VCCO
2
---
P144
-
GND
-
P45
E11
P145
-
I/O (D1)
2
P70
P44
E10
P146
419
I/O
2
P71
P43
D13
P147
422
I/O
2
-
P42
D12
P148
425
I/O, VREF
2
P72
P41
D11
P150
428
I/O
2
-
P151
431
I/O
2
-
P40
C13
P152
434
I/O (DIN, D0)
2
P73
P39
C12
P153
437
I/O (DOUT,
BUSY)
2
P74
P38
C11
P154
440
CCLK
2
P75
P37
B13
P155
443
VCCO
2
P76
P36
B12
P156
-
VCCO
1
P76
P35
A13
P156
-
TDO
2
P77
P34
A12
P157
-
GND
-
P78
P33
B11
P158
-
TDI
-
P79
P32
A11
P159
-
I/O (CS)
1
P80
P31
D10
P160
0
I/O (WRITE)
1
P81
P30
C10
P161
3
I/O
1
-
P29
B10
P162
6
I/O
1
-
P163
9
I/O, VREF
1
P82
P28
A10
P164
12
I/O
1
-
P166
15
I/O
1
P83
P27
D9
P167
18
I/O
1
P84
P26
C9
P168
21
GND
-
P25
B9
P169
-
VCCO
1
---
P170
-
XC2S30 Device Pinouts (Continued)
XC2S30 Pad Name
VQ100 TQ144 CS144 PQ208
Bndry
Scan
Function
Bank
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XC2S150-6FG456C 功能描述:IC FPGA 2.5V C-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
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