參數(shù)資料
型號: XC2S200-5FG456I
廠商: Xilinx Inc
文件頁數(shù): 65/99頁
文件大?。?/td> 0K
描述: IC FPGA 2.5V I-TEMP 456-FBGA
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-II
LAB/CLB數(shù): 1176
邏輯元件/單元數(shù): 5292
RAM 位總計: 57344
輸入/輸出數(shù): 284
門數(shù): 200000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
Spartan-II FPGA Family: DC and Switching Characteristics
DS001-3 (v2.8) June 13, 2008
Module 3 of 4
Product Specification
68
R
Revision History
Date
Version No.
Description
09/18/00
2.0
Sectioned the Spartan-II Family data sheet into four modules. Updated timing to reflect the
latest speed files. Added current supply numbers and XC2S200 -5 timing numbers. Approved
-5 timing numbers as preliminary information with exceptions as noted.
11/02/00
2.1
Removed Power Down feature.
01/19/01
2.2
DC and timing numbers updated to Preliminary for the XC2S50 and XC2S100. Industrial
power-on current specifications and -6 DLL timing numbers added. Power-on specification
clarified.
03/09/01
2.3
Added note on power sequencing. Clarified power-on current requirement.
08/28/01
2.4
Added -6 preliminary timing. Added typical and industrial standby current numbers. Specified
min. power-on current by junction temperature instead of by device type (Commercial vs.
Industrial). Eliminated minimum VCCINT ramp time requirement. Removed footnote limiting
DLL operation to the Commercial temperature range.
07/26/02
2.5
Clarified that I/O leakage current is specified over the Recommended Operating Conditions for
VCCINT and VCCO.
08/26/02
2.6
Added references for XAPP450 to Power-On Current Specification.
09/03/03
2.7
Added relaxed minimum power-on current (ICCPO) requirements to page 53. On page 64,
moved TRPW values from maximum to minimum column.
06/13/08
2.8
Updated I/O measurement thresholds. Updated description and links. Updated all modules for
continuous page, figure, and table numbering. Synchronized all modules to v2.8.
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XC2S200-5FGG256C 功能描述:IC SPARTAN-II FPGA 200K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S200-5FGG256I 功能描述:IC SPARTAN-II FPGA 200K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S200-5FGG456C 功能描述:IC SPARTAN-II FPGA 200K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S200-5FGG456C4124 制造商:Xilinx 功能描述:
XC2S200-5FGG456I 功能描述:IC SPARTAN-II FPGA 200K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)