- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4277 > XC2S200-5FGG456C (Xilinx Inc)IC SPARTAN-II FPGA 200K 456-FBGA PDF資料下載
參數(shù)資料
| 型號： | XC2S200-5FGG456C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 18/99頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SPARTAN-II FPGA 200K 456-FBGA |
| 標準包裝： | 60 |
| 系列： | Spartan®-II |
| LAB/CLB數(shù)： | 1176 |
| 邏輯元件/單元數(shù)： | 5292 |
| RAM 位總計： | 57344 |
| 輸入/輸出數(shù)： | 284 |
| 門數(shù)： | 200000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 456-BBGA |
| 供應商設(shè)備封裝： | 456-FBGA |
| 其它名稱： | 122-1312 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁當前第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
25
R
If CCLK is slower than FCCNH, the FPGA will never assert
BUSY. In this case, the above handshake is unnecessary,
and data can simply be entered into the FPGA every CCLK
cycle.
A configuration packet does not have to be written in one
continuous stretch, rather it can be split into many write
sequences. Each sequence would involve assertion of CS.
In applications where multiple clock cycles may be required
to access the configuration data before each byte can be
loaded into the Slave Parallel interface, a new byte of data
may not be ready for each consecutive CCLK edge. In such
a case the CS signal may be de-asserted until the next byte
is valid on D0-D7. While CS is High, the Slave Parallel
interface does not expect any data and ignores all CCLK
transitions. However, to avoid aborting configuration,
WRITE must continue to be asserted while CS is asserted.
Abort
To abort configuration during a write sequence, de-assert
WRITE while holding CS Low. The abort operation is
initiated at the rising edge of CCLK, as shown in Figure 21,
page 26. The device will remain BUSY until the aborted
operation is complete. After aborting configuration, data is
assumed to be unaligned to word boundaries and the FPGA
requires a new synchronization word prior to accepting any
new packets.
Boundary-Scan Mode
In the boundary-scan mode, no nondedicated pins are
required, configuration being done entirely through the
IEEE 1149.1 Test Access Port.
Configuration through the TAP uses the special CFG_IN
instruction. This instruction allows data input on TDI to be
converted into data packets for the internal configuration
bus.
The following steps are required to configure the FPGA
through the boundary-scan port.
1.
Load the CFG_IN instruction into the boundary-scan
instruction register (IR)
2.
Enter the Shift-DR (SDR) state
3.
Shift a standard configuration bitstream into TDI
4.
Return to Run-Test-Idle (RTI)
5.
Load the JSTART instruction into IR
6.
Enter the SDR state
7.
Clock TCK through the sequence (the length is
programmable)
8.
Return to RTI
Configuration and readback via the TAP is always available.
The boundary-scan mode simply locks out the other modes.
The boundary-scan mode is selected by a <10x> on the
mode pins (M0, M1, M2).
Readback
The configuration data stored in the Spartan-II FPGA
configuration memory can be readback for verification.
Along with the configuration data it is possible to readback
the contents of all flip-flops/latches, LUT RAMs, and block
RAMs. This capability is used for real-time debugging.
For more detailed information see XAPP176, Spartan-II
FPGA Family Configuration and Readback.
Figure 19: Loading Configuration Data for the Slave
Parallel Mode
Yes
No
FPGA
Driving BUSY
High?
After INIT
Goes High
Load One
Configuration
Byte on Next
CCLK Rising Edge
To CRC Check
DS001_19_032300
No
End of
Configuration
Data File?
Yes
User Drives
WRITE and CS
Low
User Drives
WRITE and CS
High
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 745777-4 | CONN D-SUB GASKET RFI 37POS TIN |
| 24LC32AFT-E/MNY | IC SRL EEPROM 4KX8 2.5V 8-TDFN |
| XC3S700A-4FG400I | IC SPARTAN-3A FPGA 700K 400FBGA |
| 554043-2 | CONN STANDOFF M3.5 SCKT #6-32 |
| 24LC64FT-E/SN | IC SRL EEPROM 8KX8 2.5V 8-SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC2S200-5FGG456C4124 | 制造商:Xilinx 功能描述: |
| XC2S200-5FGG456I | 功能描述:IC SPARTAN-II FPGA 200K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5PQ208C | 功能描述:IC FPGA 2.5V 1176 CLB'S 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5PQ208I | 功能描述:IC FPGA 2.5V I-TEMP 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5PQ208Q | 制造商:Xilinx 功能描述:XILINX XC2S200-5PQ208Q FPGA - Trays 制造商:Xilinx 功能描述:Xilinx XC2S200-5PQ208Q FPGA |
發(fā)布緊急采購，3分鐘左右您將得到回復。