V
參數(shù)資料
型號(hào)： XC4VFX12-10FFG668I
廠商： Xilinx Inc
文件頁(yè)數(shù)： 12/58頁(yè)
文件大?。?/td> 0K
描述： IC FPGA VIRTEX-4 FX 12K 668FCBGA
標(biāo)準(zhǔn)包裝： 40
系列： Virtex®-4 FX
LAB/CLB數(shù)： 1368
邏輯元件/單元數(shù)： 12312
RAM 位總計(jì)： 663552
輸入/輸出數(shù)： 320
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 668-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 668-FCBGA
配用： HW-V4-ML403-UNI-G-ND - EVALUATION PLATFORM VIRTEX-4
HW-AFX-FF668-400-ND - BOARD DEV VIRTEX 4 FF668
Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
DS302 (v3.7) September 9, 2009
Product Specification
2
VTS
Voltage applied to 3-state 3.3V output
(all user and dedicated I/Os)
–0.75 to 4.05
V
Voltage applied to 3-state 3.3V output
(restricted to maximum of 100 user I/Os)(3,4)
–0.95 to 4.4
(Commercial Temperature)
–0.85 to 4.3
(Industrial Temperature)
V
2.5V or below I/O input voltage relative to GND
(user and dedicated I/Os)
–0.75 to VCCO +0.5
V
AVCCAUXRX
Receive auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 1.32
V
AVCCAUXTX
Transmit auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 1.32
V
AVCCAUXMGT
Management auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 3.0
V
VTRX
Terminal receive supply voltage relative to GND
–0.5 to 3.0
V
VTTX
Terminal transmit supply voltage relative to GND
–0.5 to 1.65
V
TSTG
Storage temperature (ambient)
–65 to 150
° C
TSOL
Maximum soldering temperature(2)
+220
° C
TJ
Maximum junction temperature(2)
+125
° C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2.
For soldering guidelines and thermal considerations, see the Virtex-4 Packaging and Pinout Specification on the Xilinx website.
3.
When using more than 100 3.3V I/Os, refer to the Virtex-4 FPGA User Guide, Chapter 6, “3.3V I/O Design Guidelines.”
4.
For more flexibility in specific designs, a maximum of 100 user I/Os can be stressed beyond the normal spec for no more than 20% of a data period.
There are no bank restrictions.
Table 2: Recommended Operating Conditions
Symbol
Description
Min
Max
Units
VCCINT
Internal supply voltage relative to GND, TJ =0° C to +85° C
Commercial
1.14
1.26
V
Internal supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.14
1.26
V
VCCAUX
Auxiliary supply voltage relative to GND, TJ =0° C to +85° C
Commercial
2.375
2.625
V
Auxiliary supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
2.375
2.625
V
VCCO(1,3,4,5)
Supply voltage relative to GND, TJ =0° C to +85° C
Commercial
1.14
3.45
V
Supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.14
3.45
V
VIN
3.3V supply voltage relative to GND, TJ =0° C to +85° C
Commercial
GND – 0.20
3.45
V
3.3V supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
GND – 0.20
3.45
V
2.5V and below supply voltage relative to GND,
TJ =0° C to +85° C
Commercial
GND – 0.20
VCCO +0.2
V
2.5V and below supply voltage relative to GND,
TJ =–40° C to +100° C
Industrial
GND – 0.20
VCCO +0.2
V
IIN
Maximum current through any pin in a powered or unpowered
bank when forward biasing the clamp diode.
Commercial
10
mA
Industrial
10
mA
Battery voltage relative to GND, TJ =0° C to +85° CCommercial
1.0
3.6
V
Battery voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.0
3.6
V
Table 1: Absolute Maximum Ratings (Continued)
Symbol
Description
Units
相關(guān)PDF資料
PDF描述
RCB106DHBD-S621 EDGECARD 212POS DIP R/A .050 SLD
XCV200E-7FG256C IC FPGA 1.8V C-TEMP 256-FBGA
23A256T-I/ST IC SRAM 256KBIT 20MHZ 8TSSOP
XCV200E-6FG256I IC FPGA 1.8V I-TEMP 256-FBGA
ACB95DHNT CONN EDGECARD 190PS .050 DIP SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC4VFX12-10SF363C 制造商:Xilinx 功能描述:FPGA VIRTEX-4 12312 CELLS 90NM 1.2V 363FCBGA - Trays
XC4VFX12-10SF363CES 制造商:Xilinx 功能描述:
XC4VFX12-10SF363I 功能描述:IC FPGA VIRTEX-4FX 363FCBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Virtex®-4 FX 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC4VFX12-10SFG363C 功能描述:IC FPGA VIRTEX-4 FX 12K 363FCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Virtex®-4 FX 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC4VFX12-10SFG363I 功能描述:IC FPGA VIRTEX-4 FX 12K 363FCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Virtex®-4 FX 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*