DS123 (v2.18) May 19, 2010
Product Specification
1
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other countries. All other trademarks are the property of their respective owners.
Features
In-System Programmable PROMs for Configuration of
Xilinx FPGAs
Low-Power Advanced CMOS NOR Flash Process
Endurance of 20,000 Program/Erase Cycles
Operation over Full Industrial Temperature Range
(–40°C to +85°C)
IEEE Standard 1149.1/1532 Boundary-Scan (JTAG)
Support for Programming, Prototyping, and Testing
JTAG Command Initiation of Standard FPGA
Configuration
Cascadable for Storing Longer or Multiple Bitstreams
Dedicated Boundary-Scan (JTAG) I/O Power Supply (VCCJ)
I/O Pins Compatible with Voltage Levels Ranging From
1.8V to 3.3V
Design Support Using the Xilinx ISE Alliance and
Foundation Software Packages
XCF01S/XCF02S/XCF04S
3.3V Supply Voltage
Serial FPGA Configuration Interface
Available in Small-Footprint VO20 and VOG20
Packages
XCF08P/XCF16P/XCF32P
1.8V Supply Voltage
Serial or Parallel FPGA Configuration Interface
Available in Small-Footprint VOG48, FS48, and
FSG48 Packages
Design Revision Technology Enables Storing and
Accessing Multiple Design Revisions for
Configuration
Built-In Data Decompressor Compatible with Xilinx
Advanced Compression Technology
Description
Xilinx introduces the Platform Flash series of in-system
programmable configuration PROMs. Available in
1 to 32 Mb densities, these PROMs provide an easy-to-use,
cost-effective, and reprogrammable method for storing large
Xilinx FPGA configuration bitstreams. The Platform Flash
PROM series includes both the 3.3V XCFxxS PROM and
the 1.8V XCFxxP PROM. The XCFxxS version includes
4 Mb, 2 Mb, and 1 Mb PROMs that support Master Serial
and Slave Serial FPGA configuration modes (
Figure 1,page 2). The XCFxxP version includes 32 Mb, 16 Mb, and
8 Mb PROMs that support Master Serial, Slave Serial,
Master SelectMAP, and Slave SelectMAP FPGA
When driven from a stable, external clock, the PROMs can
A summary of the Platform Flash PROM family members
and supported features is shown in
Table 1.35
Platform Flash In-System Programmable
Configuration PROMs
DS123 (v2.18) May 19, 2010
Product Specification
R
Table 1: Platform Flash PROM Features
Device
Density
(Mb)
VCCINT
(V)
VCCO Range
(V)
VCCJ Range
(V)
Packages
Program In-system
via JTAG
Serial
Config.
Parallel
Config.
Design
Revisioning
Compression
XCF01S
1
3.3
1.8 – 3.3
2.5 – 3.3
VO20/VOG20
XCF02S
2
3.3
1.8 – 3.3
2.5 – 3.3
VO20/VOG20
XCF04S
4
3.3
1.8 – 3.3
2.5 – 3.3
VO20/VOG20
XCF08P
8
1.8
1.8 – 3.3
2.5 – 3.3
VO48/VOG48
FS48/FSG48
(1)
XCF16P
16
1.8
1.8 – 3.3
2.5 – 3.3
VO48/VOG48
FS48/FSG48
XCF32P
32
1.8
1.8 – 3.3
2.5 – 3.3
VO48/VOG48
FS48/FSG48
Notes:
1.