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參數(shù)資料
| 型號： | XP161A1265PR |
| 廠商： | TOREX SEMICONDUCTOR LTD. |
| 英文描述： | RES CERAMIC 4MHZ .5% SMD |
| 中文描述： | 功率MOS場效應(yīng)管 |
| 文件頁數(shù)： | 2/4頁 |
| 文件大小： | 54K |
| 代理商： | XP161A1265PR |
u
DC characteristics
PARAMETER
Drain Cut-off Current
Ta=25
:
UNITS
μ
A
I
Electrical Characteristics
Gate-Source Cut-off Voltage
Vgs(off)
0.7
1.4
0.055
V
0.095
0.07
Id=2A, Vgs=2.5V
Gate-Source Leakage Current
Igss
μ
A
±
10
Forward Transfer Admittance
(note)
8
S
Body Drain Diode
Forward Voltage
0.85
1.1
V
Idss
10
Vf
Vds=20V, Vgs=0V
Vgs=
±
12V, Vds=0V
Id=1mA, Vds=10V
Id=2A, Vgs=4.5V
Id=2A, Vds=10V
If=4A, Vgs=0V
Drain-Source On-state
Resistance (note)
Rds(on)
0.042
SYMBOL
CONDITIONS
MAX
MIN
TYP
PARAMETER
Input Capacitance
UNITS
pF
Feedback Capacitance
Crss
pF
Output Capacitance
Coss
pF
Ciss
80
190
320
Vds=10V, Vgs=0V
f=1MHz
SYMBOL
CONDITIONS
MAX
MIN
TYP
Dynamic characteristics
Ta=25
:
Effective during pulse test.
Note:
Yfs
PARAMETER
Turn-on Delay Time
UNITS
ns
Fall Time
tf
ns
Rise Time
Turn-off Delay Time
tr
ns
ns
td (on)
40
td (off)
55
15
10
Vgs=5V, Id=2A
Vdd=10V
SYMBOL
CONDITIONS
MAX
MIN
TYP
Switching characteristics
Ta=25
:
PARAMETER
Thermal Resistance
(channel-surroundings)
UNITS
Rth (ch-a)
62.5
:
/W
Implement on a glass epoxy
resin PCB
SYMBOL
CONDITIONS
MAX
MIN
TYP
Thermal characteristics
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