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參數(shù)資料
型號(hào): XR16L2550IL-F
廠商: Exar Corporation
文件頁(yè)數(shù): 28/44頁(yè)
文件大小: 0K
描述: IC UART FIFO 16B DUAL 32QFN
標(biāo)準(zhǔn)包裝: 490
特點(diǎn): *
通道數(shù): 2,DUART
FIFO's: 16 字節(jié)
規(guī)程: RS232
電源電壓: 2.25 V ~ 5.5 V
帶自動(dòng)流量控制功能:
帶IrDA 編碼器/解碼器:
帶故障啟動(dòng)位檢測(cè)功能:
帶調(diào)制解調(diào)器控制功能:
帶CMOS:
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 32-QFN 裸露焊盤(pán)(5x5)
包裝: 托盤(pán)
ABSOLUTE MAXIMUM RATINGS
Power Supply Range
7 Volts
Voltage at Any Pin
GND-0.3 V to +5.5 V
Operating Temperature
-40o to +85oC
Storage Temperature
-65o to +150oC
Package Dissipation
500 mW
TYPICAL PACKAGE THERMAL RESISTANCE DATA (MARGIN OF ERROR: ± 15%)
Thermal Resistance (48-TQFP)
theta-ja =59oC/W, theta-jc = 16oC/W
Thermal Resistance (44-PLCC)
theta-ja = 50oC/W, theta-jc = 21oC/W
Thermal Resistance (32-QFN)
theta-ja = oC/W, theta-jc = oC/W
ELECTRICAL CHARACTERISTICS
DC ELECTRICAL CHARACTERISTICS
UNLESS OTHERWISE NOTED: TA=-40O TO +85OC, VCC IS 2.25 TO 5.5V
SYMBOL
PARAMETER
2.5V LIMITS
MIN
MAX
3.3V LIMITS
MIN
MAX
5.0V LIMITS
MIN
MAX
UNITS
CONDITIONS
VILCK
Clock Input Low Level
-0.3
0.2
-0.3
0.6
-0.5
0.6
V
VIHCK
Clock Input High Level
2.0
5.5
2.4
5.5
3.0
5.5
V
VIL
Input Low Voltage
-0.3
0.6
-0.3
0.8
-0.5
0.8
V
VIH
Input High Voltage
2.0
5.5
2.0
5.5
2.2
5.5
V
VOL
Output Low Voltage
0.4
V
IOL = 6 mA
IOL = 4 mA
IOL = 2 mA
VOH
Output High Voltage
1.8
2.0
2.4
V
IOH = -6 mA
IOH = -1 mA
IOH = -400 uA
IIL
Input Low Leakage Current
±10
uA
IIH
Input High Leakage Current
±10
uA
CIN
Input Pin Capacitance
5
pF
ICC
Power Supply Current
1
1.3
3
mA
ISLEEP
Sleep Current
6
15
30
uA
See Test 1
XR16L2550
34
LOW VOLTAGE DUART WITH 16-BYTE FIFO
REV. 1.1.3
Test 1: The following inputs must remain steady at VCC or GND state to minimize Sleep current: A0-A2, D0-
D7, IOR#, IOW#, CSA#, CSB#, and all modem inputs. Also, RXA and RXB inputs must idle at logic 1 state
while asleep. Floating inputs will result in sleep currents in the mA range. For PowerSave feature that isolates
address, data and control signals, please see the XR16L2551 datasheet.
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