參數(shù)資料
型號(hào): YNV12T05-0
廠商: POWER-ONE INC
元件分類: 電源模塊
英文描述: 1-OUTPUT DC-DC REG PWR SUPPLY MODULE
封裝: SIP-5
文件頁(yè)數(shù): 1/27頁(yè)
文件大?。?/td> 393K
代理商: YNV12T05-0
Data Sheet
9.6 - 14Vdc Input; 5A, 0.7525 - 5.5Vdc Programmable Output
Rev 1 07-01-04
WWW.POWER-ONE.COM
Page 1 of 27
di/dt
Nex
TM
-v Series: YNV12T05
Applications
Intermediate Bus Architectures
Telecommunications
Data Communications
Servers, Workstations
Distributed Power Architectures
Benefits
High efficiency – no heat sink required
Reduces Total Solution Board Area
Minimizes Part Numbers in Inventory
PRODUCTS: Nex
TM FAMILY
Features
Delivers up to 5A (18.1W)
Industry-standard footprint and pinout
Single-in-Line (SIP) Package: 0.90” x 0.40” x 0.213”
(22.86mm x 10.16mm x 5.41mm)
Weight: 0.08 oz [2.22 g]
Synchronous Buck Converter Topology
Start up into pre-biased output
No minimum load required
Operating ambient temperature: -40°C to 85°C
Remote output sense
Remote ON/OFF
Fixed frequency operation
Auto-reset output over-current protection
Auto-reset over-temperature protection
High reliability, MTBF = TBD Million Hours
All materials meet UL94, V-0 flammability rating
UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950 (pending)
Description
The Nex
TM
-v Series of non-isolated DC/DC modules deliver up to 5A of output current in an industry-standard
through hole (SIP) package. The YNV12T05 modules of the Nex
TM
-v Series operate from a 9.6Vdc–14Vdc
input. These modules are ideal choices for Intermediate Bus Architectures where Point-of-Load power
delivery is generally a requirement. They provide a resistor-programmable regulated output voltage of
0.7525V to 5.5V.
The Nex
TM
-v Series of modules provide exceptional thermal performance, even in high temperature
environments with minimal airflow. This is accomplished through the use of circuit, packaging and processing
techniques to achieve ultra-high efficiency, excellent thermal management and a very sleek body profile.
The sleek body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
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