參數(shù)資料
型號(hào)： μPD78P064
廠商： NEC Corp.
元件分類(lèi)： 8位微控制器
英文描述： 8 Bit Single Chip Microcontrollers
中文描述： 8位單片機(jī)微控制器
文件頁(yè)數(shù)： 12/70頁(yè)
文件大?。?/td> 473K
代理商： ΜPD78P064
12
m
PD78P064
CONTENTS
1.
DIFFERENCES BETWEEN
m
PD78P064 AND MASK ROM PRODUCTS..............................................13
2.
PIN FUNCTION TABLE ............................................................................................................................ 14
2.1
PINS IN NORMAL OPERATING MODE ........................................................................................................... 14
2.2
PINS IN PROM PROGRAMMING MODE ......................................................................................................... 17
2.3
PIN INPUT/OUTPUT CIRCUITS AND RECOMMENDED CONNECTION OF UNUSED PINS...................... 18
3.
MEMORY SIZE SWITCHING REGISTER (IMS) ......................................................................................21
4.
PROM PROGRAMMING ...........................................................................................................................22
4.1
OPERATING MODES......................................................................................................................................... 22
4.2
PROM WRITE PROCEDURE ............................................................................................................................ 24
4.3
PROM READ PROCEDURE.............................................................................................................................. 28
5.
ERASURE METHOD (
m
PD78P064KL-T ONLY) ......................................................................................29
6.
ERASURE WINDOW SEAL (
m
PD78P064KL-T ONLY) ...........................................................................29
7.
ONE-TIME PROM PRODUCTS SCREENING ......................................................................................... 30
8.
ELECTRICAL SPECIFICATIONS............................................................................................................31
9.
CHARACTERISTIC CURVES (REFERENCE VALUES) .........................................................................54
10. PACKAGE DRAWINGS ............................................................................................................................ 56
11. RECOMMENDED SOLDERING CONDITIONS .....................................................................................60
APPENDIX A. DEVELOPMENT TOOLS .......................................................................................................61
APPENDIX B. RELATED DOCUMENTS.......................................................................................................66
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