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參數(shù)資料
| 型號： | μPD78P064 |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8 Bit Single Chip Microcontrollers |
| 中文描述： | 8位單片機(jī)微控制器 |
| 文件頁數(shù)： | 60/70頁 |
| 文件大?。?/td> | 473K |
| 代理商： | ΜPD78P064 |
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60
m
PD78P064
11. RECOMMENDED SOLDERING CONDITIONS
The
m
PD78P064 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 11-1. Surface Mounting Type Soldering Conditions
(1)
m
PD78P064GC-7EA: 100-pin plastic QFP (fine pitch) (14
￥
14 mm)
m
PD78P064GC-8EU: 100-pin plastic LQFP (fine pitch) (14
￥
14 mm)
Soldering Method
Soldering Conditions
Recommended
Soldering Symbols
Infrared reflow
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125 °C)
<Precaution>
Products cannot be baked while packed in anything other than in a heat resistant tray
(i.e. they cannot be baked in a magazine, taping, or heat-labile tray).
IR35-107-2
VPS
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125 °C)
<Precaution>
Products cannot be baked while packed in anything other than in a heat resistant tray
(i.e. they cannot be baked in a magazine, taping, or heat-labile tray).
VP15-107-2
Partial heating
Pin temperature: 300 °C max., Duration: 3 sec. max. (per device side)
—
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25 °C, 65 % RH.
(2)
m
PD78P064GF-3BA: 100-pin plastic QFP (14
￥
20 mm)
Soldering Method
Soldering Conditions
Recommended
Soldering Symbols
Infrared reflow
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Three times max.
IR35-00-3
VPS
Package peak temperature: 215 °C, Duration: 40 sec. (at 200 °C or above),
Number of times: Three times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260 °C max., Duration: 10 sec. max., Number of times:
Once, Preheating temperature: 120 °C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C max., Duration: 3 sec. max. (per device side)
—
Caution
Use of more than one soldering method should be avoided (except in the case of partial heating).
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