參數(shù)資料
型號(hào): 0W344-004-XTP
廠商: ON Semiconductor
文件頁數(shù): 37/43頁
文件大?。?/td> 0K
描述: DSP BELASIGNA 200 AUDIO 52-NQFN
產(chǎn)品變化通告: BelaSigna 200 QFN Obsolescence 09/Dec/2009
標(biāo)準(zhǔn)包裝: 500
系列: BelaSigna® 200
類型: 音頻處理器
應(yīng)用: 便攜式設(shè)備
安裝類型: 表面貼裝
封裝/外殼: 52-TFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 52-NQFP(8x8)
包裝: 帶卷 (TR)
BelaSigna 200
13.0 Re-flow Information
The re-flow profile depends on the equipment that is used for the reflow and the assembly that is being reflowed. Use the following
table from the JEDEC Standard 22-A113D Para 3.1.6 for Sn-Pb Eutectic Assembly as a guideline:
Table 17: Re-flow Information
Profile Feature
Sn-Pb Eutectic Assembly
Pb-free Assembly
Average Ramp-Up Rate
(TL to TP)
3°C/second maximum
Preheat
Temperature minimum (TSMIN)
100°C
150°C
Temperature maximum (TSMAX)
150°C
200°C
Time (min. to max.) (ts)
60-120 seconds
60-180 seconds
TSMAX to TL
Ramp-up rate
3°C/second maximum
Time Maintained Above
Temperature (TL)
183°C
217°C
Time (tL)
60-150 seconds
Peak Temperature (TP)
240 +0/-5°C
260 +0/-5°C
Time within 5°C of Actual Peak Temperature
10-30 seconds
Ramp-Down Rate
6°C/second maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
All BelaSigna 200 QFNs with part number revisions 003 (i.e. 0W344-003-XTP) and higher are Pb-free and should follow the re-flow
guidelines for Pb-free assemblies. All BelaSigna 200 CSPs are Pb-free.
14.0 ESD Sensitive Device
CAUTION:
Electrostatic discharge (ESD) sensitive device. Permanent damage may occur on devices subjected
to high-energy electrostatic discharges. Proper ESD precautions in handling, packaging and testing are
recommended to avoid performance degradation or loss of functionality.
15.0 Training
To facilitate development on the BelaSigna 200 platform, training is available upon request. Contact your account manager for more
information.
Rev. 16 | Page 42 of 43 | www.onsemi.com
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