參數(shù)資料
型號(hào): 0W344-004-XTP
廠商: ON Semiconductor
文件頁(yè)數(shù): 5/43頁(yè)
文件大?。?/td> 0K
描述: DSP BELASIGNA 200 AUDIO 52-NQFN
產(chǎn)品變化通告: BelaSigna 200 QFN Obsolescence 09/Dec/2009
標(biāo)準(zhǔn)包裝: 500
系列: BelaSigna® 200
類(lèi)型: 音頻處理器
應(yīng)用: 便攜式設(shè)備
安裝類(lèi)型: 表面貼裝
封裝/外殼: 52-TFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 52-NQFP(8x8)
包裝: 帶卷 (TR)
BelaSigna 200
4.2.3. CSP Environmental Characteristics
All parts supplied against this specification have been qualified as follows:
Table 5:
Packaging Level
Moisture sensitivity level (MSL)
JEDEC Level 3
30°C / 60% RH for 192 hours
Pressure cooker test (PCT)
121°C / 100% RH / 2 atm for 168 hours
Thermal cycling test (TCT)
-65°C to 150°C for 1000 cycles
Highly accelerated stress test (HAST)
130°C / 85% RH for 100 hours
High temperature stress test (HTST)
150°C for 1000 hours
Board Level
Temperature
-40°C to 125°C for 1000 cycles with no failures
(for board thickness <40mils and underfilled CSP)
Drop
1m height with no failures
4.2.4. CSP Carrier Information
The devices will be provided in standard 7” Tape & Reel carrier with 5,000 parts per reel.
Note: all dimensions in millimeters
Figure 8: CSP Tape Dimensions
4.2.5. CSP Design Considerations
In order to achieve the highest level of miniaturization, the CSP package is constrained in ways that will factor into design decisions.
The CSP will only operate in HV mode, and therefore requires a 1.8V operating voltage. The number of pins is reduced to 40
(compared to 49 active pins on the QFN). This reduction eliminates access to GPIOs (0,1,2,6,15), LSAD 2, the I2S interface, and the IR
remote receiver.
For PCB manufacture with BelaSigna 200 CSP, ON Semiconductor recommends Solder-on-Pad (SoP) surface finish. With SoP, the
solder mask opening should be solder mask-defined and copper pad geometry will be dictated by the PCB vendor’s design
requirements.
Rev. 16 | Page 13 of 43 | www.onsemi.com
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