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參數(shù)資料
| 型號(hào)： | 21531G |
| 英文描述： | Programmable 8 bit Silicon Delay Line |
| 中文描述： | AMD的快閃記憶體快速參考指南- 2003年2月版 |
| 文件頁數(shù)： | 16/17頁 |
| 文件大小： | 606K |
| 代理商： | 21531G |
15
Flash + SRAM MCP Ordering Part Number Designators
Am
42
DL
640
A
G
T
85
I
T
PACKING METHOD
T
=
7” Tape and Reel
S
=
13” Tape and Reel
TEMPERATURE RANGE
I
=
Industrial (–40
°
C to +85
°
C)
L
=
Light Industrial (–30
°
C to +85
°
C)
FLASH+SRAM SPEED OPTION (t
ACC
)
70
=
70 ns Flash and SRAM
71
=
70 ns Flash, 55 ns SRAM
85
=
85 ns Flash and SRAM
SECTOR ARCHITECTURE AND SECTOR WRITE PROTECTION
T
=
Top boot sector
B
=
Bottom boot sector
Blank
Flexible Bank organization is configurable for top or bottom boot
=
Uniform sector
PROCESS TECHNOLOGY
B
=
0.32 μm technology
C
=
0.32 μm thin-film technology
D
G
=
=
0.23 μm thin-film technology
0.17 μm thin-film technology
SRAM DENSITY
2
=
4
=
8
=
2 Mbit
4 Mbit
8 Mbit
A
B
C
C8
CD
=
=
=
=
=
16 Mbit
32 Mbit
64 Mbit
64 Mbit SRAM and 8 Mbit pSRAM
64 Mbit SRAM and 128 Mbit DiskOnChip
FLASH MEMORY DENSITY/BANK SPLIT RATIO
16x =
16 Mbit
32x =
32 Mbit
x = 0 (4 banks, 1:4:4:1 ratio)
x = 1 (2 banks, 1:31 ratio)
x = 2 (2 banks, 1:7 ratio)
x = 3 (2 banks, 1:3 ratio)
x = 4 (2 banks, 1:1 ratio)
640 =
128 =
64 Mbit
128 Mbit
AMD FLASH MEMORY ARCHITECTURE
BDS =
1.8 V Simultaneous Read/Write + Burst Mode
DL
=
3 V Simultaneous Read/Write
PDS =
1.8 V Simultaneous Read/Write + Page Mode
PACKAGE TYPE
Package designators are not included in MCP part numbers. See device listings in
this publication for package types. Package type definitions for MCP are as follows:
FLA069
=
69 balls, 8 x 11 mm body
FLB073
=
73 balls, 8 x 11.6 mm body
FLB093
=
93 balls, 8 x 11.6 mm body
FLJ073
=
73 balls, 8 x 11.6 mm body
FMA093
=
93 balls, 10 x 10 mm body
FNA093
=
93 balls, 10 x 10 mm body
FSC073
=
93 balls, 8 x 11.6 mm body
FSC093
=
93 balls, 8 x 11.6 mm body
FTA073
=
73 balls, 8 x 11.6 mm body
FTA088
=
88 balls, 8 x 11.6 mm body
FVC093
=
93 balls, 9 x 13 mm body
All packages are Fine-pitch Ball Grid Arrays (BGAs), 0.8 mm ball pitch. Differences
between package dimensions may also include body height and thickness, ball grid
size, and ball height and diameter. Consult the physical dimensions section in the
appropriate data sheet for more details.
FLASH +SRAM COMBINATIONS
41
=
Flash (x8/x16) + SRAM (x8/x16)
42
=
Flash (x8/x16) + SRAM (x16)
45
=
Flash (x8/x16) + Pseudo SRAM (x8/x16)
49
=
Flash (x8/x16) + Pseudo SRAM (x16)
50
=
Stacked Flash (x8/x16) + Pseudo SRAM (x16)
55
=
Flash + FastCycle RAM + SRAM (all x16)
58
=
Stacked Flash + Pseudo SRAM + DiskOnChip
AMD PRODUCTS
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| 21-531N | 制造商:JAMECO KITPRO 功能描述:KIT,IR REMOTE CONTROL TITAN TANK,6 WHEEL DRV,BATTLE OTHER TA |
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| 2-1532004-9 | 制造商:TE Connectivity 功能描述:031-0052-0001 - Bulk |
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| 2-1532005-3 | 制造商:TE Connectivity 功能描述:130-7001-1019 - Bulk 制造商:TE CONNECTIVITY 功能描述:130-7001-1019=C/ASTRPLUGBOTHE |
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