參數(shù)資料
型號: 25AA1024
廠商: Microchip Technology Inc.
英文描述: 1 Mbit SPI Bus Serial EEPROM
中文描述: 1兆位SPI總線串行EEPROM
文件頁數(shù): 21/30頁
文件大?。?/td> 459K
代理商: 25AA1024
2007 Microchip Technology Inc.
Preliminary
DS21836D-page 21
25AA1024/25LC1024
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
1.27 BSC
0.85
0.65
0.01
0.20 REF
4.92 BSC
4.67 BSC
4.00
5.99 BSC
5.74 BSC
2.31
0.40
0.60
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
N
e
A
A2
A1
A3
D
D1
D2
E
E1
E2
b
L
K
φ
1.00
0.80
0.05
0.00
3.85
4.15
2.16
0.35
0.50
0.20
2.46
0.47
0.75
12°
φ
NOTE 2
A
3
A2
A1
A
NOTE 1
NOTE 1
EXPOSED
PAD
BOTTOM VIEW
1
2
D2
2
1
E2
K
L
N
e
b
E
E1
D
D1
N
TOP VIEW
Microchip Technology Drawing C04-113B
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