82803AA MRH-R
R
Datasheet
Contents
1.
Overview.......................................................................................................................................9
1.1.
System Architecture.........................................................................................................9
1.2.
‘Expansion’ Channel Interface .......................................................................................10
1.3.
MRH-R Direct RDRAM ‘Stick’ Channel Interface...........................................................10
1.4.
Register Interface...........................................................................................................11
1.5.
Terminology ...................................................................................................................11
2.
Signal Description.......................................................................................................................13
2.1.
‘Expansion’ Channel Interface .......................................................................................13
2.2.
‘Stick’ Channel A Interface.............................................................................................14
2.3.
‘Stick’ Channel B Interface.............................................................................................15
2.4.
Miscellaneous Signals Interface.....................................................................................15
2.4.1.
MRH_SIO and SMBus Signal Interface.......................................................15
2.4.2.
Clocks, Reset, and Miscellaneous...............................................................16
2.4.3.
Voltage/Ground References .......................................................................16
3.
Register Description ...................................................................................................................17
3.1.
MDID—MRH-R Device ID Register ...............................................................................17
3.2.
EXCC—Expansion Bus Current Control Register .........................................................18
3.3.
CACC—Channel A Current Control Register.................................................................18
3.4.
CBCC—Channel B Current Control Register.................................................................19
3.5.
SPDRDR—SPD Read Data and Status Register..........................................................19
3.6.
CCR—Clock Control Register........................................................................................20
3.7.
LMTR—Levelization Mode And Timing Register...........................................................20
3.7.1.
RIR—RAC Initialization Register..................................................................22
3.8.
RACAL—Stick Channel A RAC Configuration Low WORD Register ............................23
3.9.
RACAH—Stick Channel A RAC Configuration High WORD Register...........................23
3.10.
RACBL—Stick Channel B RAC Configuration Low Word Register...............................23
3.11.
RACBH—Stick Channel B RAC Configuration High Word Register..............................24
3.12.
RACXL—Expansion Channel RAC Configuration Low Word Register .........................24
3.13.
RACXH—Expansion Channel RAC Configuration High Word Register........................25
3.14.
INIT—MRH-R Initialization Register...............................................................................25
3.15.
CNFGA—MRH-R Configuration Register......................................................................26
3.16.
ST—Stepping Register ..................................................................................................26
4.
Functional Description................................................................................................................27
4.1.
MRH-R and the Direct RDRAM Channel.......................................................................27
4.1.1.
Operation Overview .....................................................................................27
4.1.2.
Signal and Protocol Overview......................................................................27
4.1.2.1.
Refresh and Post-Refresh Precharge.............................................28
4.1.2.2.
Power Mode Control........................................................................28
4.1.2.3.
Current Calibration..........................................................................28
4.1.2.4.
Thermal Sensor Read.....................................................................29
4.1.2.5.
Temperature Calibration .................................................................29
4.1.3.
CMOS Protocol............................................................................................29