參數(shù)資料
型號(hào)： A3P400-FGG256
廠商： Microsemi SoC
文件頁(yè)數(shù)： 21/27頁(yè)
文件大?。?/td> 0K
描述： IC FPGA 194I/O 256FBGA
標(biāo)準(zhǔn)包裝： 90
系列： ProASIC3
RAM 位總計(jì)： 55296
輸入/輸出數(shù)： 178
門(mén)數(shù)： 400000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FPBGA（17x17）
其它名稱： 1100-1031
3
www.microsemi.com/soc
Whether you’re designing at the board or system level,
Microsemi’s customizable System-on-Chip (cSoC) devices and low
power FPGAs are your best choice. The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability,
sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
Now, more than ever,
power matters.
Table of Contents
SmartFusion
Customizable System-on-Chip (cSoC)
4
Fusion
Mixed Signal FPGAs
5
Extended Temperature Fusion
Mixed Signal Integration Down to –55C
Reprogrammable Digital Logic and Configurable Analog
Embedded Flash Memory
6
IGLOO/e
Low Power
Small Package Footprint
High Logic Density
7
IGLOO nano
Low Power
Small Package Footprint
8
IGLOO PLUS
Low Power
Small Package Footprint
High I/O-to-Logic Ratio
9
ProASIC3/E
High Logic Density
High Performance
Low Cost
10
ProASIC3 nano
Small Package Footprint
High Performance
Low Cost
11
ProASIC3L
Low Power
High Logic Density
High Performance
Low Cost
12
Military ProASIC3/EL
Unprecedented Low Power Consumption Across
the Full Military Temperature Range
High-Density Fine-Pitch Ball Grid Packaging
High Performance and Easy In-System Programming
13
Military ProASICPLUS
Industry’s First Military Screened Flash FPGA
Full Processing to MIL-STD-883 Class B
Established Heritage on Commercial and Military Aircraft
13
I/O Table
I/O Counts
14
FPGA Packages
Package Dimensions
16
Axcelerator
18
SX-A
19
MX
20
Design Tools
Design Environment for Microsemi Flash Devices
21
Development Kits
Starter, Evaluation and Demonstration Kits
22
Programmers
FlashPro3 and Silicon Sculptor 3 Programmers
26
Intellectual Property Cores
Microsemi IP Cores
27
Please refer to www.microsemi.com/soc and appropriate product datasheets for the latest device information, valid ordering codes and more
information regarding previous generations of flash and antifuse FPGAs.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3P400-FGG256I 功能描述:IC FPGA 1KB FLASH 400K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A3P400-FGG256X212 制造商:Microsemi Corporation 功能描述:
A3P400-FGG484 功能描述:IC FPGA 194I/O 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
A3P400-FGG484I 功能描述:IC FPGA 1KB FLASH 400K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A3P400-FPQ144 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
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