tIRD1 FO = 1" />
參數(shù)資料
型號: A40MX02-PLG44
廠商: Microsemi SoC
文件頁數(shù): 93/142頁
文件大?。?/td> 0K
描述: IC FPGA 57I/O 44PLCC
標(biāo)準(zhǔn)包裝: 27
系列: MX
輸入/輸出數(shù): 34
門數(shù): 3000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 44-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 44-PLCC(16.59x16.59)
其它名稱: 1100-1043
40MX and 42MX FPGA Families
1- 50
R e v i sio n 1 1
Input Module Predicted Routing Delays1
tIRD1
FO = 1 Routing Delay
2.9
3.3
3.8
4.5
6.3
ns
tIRD2
FO = 2 Routing Delay
3.6
4.2
4.8
5.6
7.8
ns
tIRD3
FO = 3 Routing Delay
4.4
5.0
5.7
6.7
9.4
ns
tIRD4
FO = 4 Routing Delay
5.1
5.9
6.7
7.8
11.0
ns
tIRD8
FO = 8 Routing Delay
8.0
9.3
10.5
12.4
17.2
ns
Global Clock Network
tCKH
Input LOW to HIGH
FO = 16
FO = 128
6.4
7.4
8.4
9.9
13.8
ns
tCKL
Input HIGH to LOW
FO = 16
FO = 128
6.8
7.8
8.9
10.4
14.6
ns
tPWH
Minimum Pulse
Width HIGH
FO = 16
FO = 128
3.1
3.3
3.6
3.8
4.1
4.3
4.8
5.1
6.7
7.1
ns
tPWL
Minimum Pulse
Width LOW
FO = 16
FO = 128
3.1
3.3
3.6
3.8
4.1
4.3
4.8
5.1
6.7
7.1
ns
tCKSW
Maximum Skew
FO = 16
FO = 128
0.6
0.8
0.6
0.9
0.7
1.0
0.8
1.2
1.6
ns
tP
Minimum Period
FO = 16
FO = 128
6.5
6.8
7.5
7.8
8.5
8.9
10.1
10.4
14.1
14.6
ns
fMAX
Maximum Frequency FO = 16
FO = 128
113
109
105
101
96
92
83
80
50
48
MHz
TTL Output Module Timing4
tDLH
Data-to-Pad HIGH
4.7
5.4
6.1
7.2
10.0
ns
tDHL
Data-to-Pad LOW
5.6
6.4
7.3
8.6
12.0
ns
tENZH
Enable Pad Z to HIGH
5.2
6.0
6.9
8.1
11.3
ns
tENZL
Enable Pad Z to LOW
6.6
7.6
8.6
10.1
14.1
ns
tENHZ
Enable Pad HIGH to Z
11.1
12.8
14.5
17.1
23.9
ns
tENLZ
Enable Pad LOW to Z
8.2
9.5
10.7
12.6
17.7
ns
dTLH
Delta LOW to HIGH
0.03
0.04
0.06
ns/pF
dTHL
Delta HIGH to LOW
0.04
0.05
0.06
0.08
ns/pF
Table 1-31 A40MX04 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCC = 3.0 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Units
Parameter / Description
Min. Max. Min. Max. Min.
Max. Min. Max. Min. Max.
Notes:
1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.
3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer tool from the Designer software to check
the hold time for this macro.
4. Delays based on 35 pF loading.
相關(guān)PDF資料
PDF描述
A3P400-FGG256 IC FPGA 194I/O 256FBGA
EEC10DREH-S93 CONN EDGECARD 20POS .100 EYELET
GMC49DRYH-S734 CONN EDGECARD 98POS DIP .100 SLD
MSC8126TMP6400 DSP 16BIT 400MHZ MULTI 431FCPBGA
FMC15DRXS-S734 CONN EDGECARD 30POS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A40MX02-PLG44I 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A40MX02-PLG44M 制造商:Microsemi Corporation 功能描述:FPGA 40MX Family 3K Gates 295 Cells 83MHz/139MHz 0.45um Technology 3.3V/5V 44-Pin PLCC 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC
A40MX02-PLG68 功能描述:IC FPGA 57I/O 68PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP(28x28)
A40MX02-PLG68A 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A40MX02-PLG68I 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)