參數(shù)資料
型號(hào): A42MX09-PQG100
廠商: Microsemi SoC
文件頁數(shù): 47/142頁
文件大?。?/td> 0K
描述: IC FPGA 104I/O 100PQFP
標(biāo)準(zhǔn)包裝: 66
系列: MX
輸入/輸出數(shù): 83
門數(shù): 14000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 100-BQFP
供應(yīng)商設(shè)備封裝: 100-PQFP(14x20)
其它名稱: 1100-1050
Datasheet Information
3- 2
R ev isio n 1 1
v6.0
(continued)
and
and the tables were updated.
updated.
In the "PQ100" table, Pin 64 (42MX09 and 42MX16) has changed to LP.
In the "PQ160" table, Pin 61 (42MX09, 42MX16, and 42MX64) has changed to LP.
In the "PQ208" table, the following pins changed:
Pin 129 (42MX09, 42MX16, and 42MX64) has changed to LP.
Pin 198 (42MX09) has changed to I/O.
The n the "PQ240" table, Pin 91 (42MX36) has changed to LP.
In the "VQ100" table, Pin 62 (42MX09 and 42MX16) has changed to LP.
In the "TQ176" table, Pin 109 (42MX09 and 42MX16) has changed to LP.
In the "BG272" table, Pin K20 (42MX36) has changed to LP.
v5.1
v5.0
Because the changes in this data sheet are extensive and technical in nature, this
should be viewed as a new document. Please read it as you would a datasheet that is
published for the first time.
ALL
Note that the “Package Characteristics and Mechanical Drawings” section has been
eliminated from the datasheet. The mechanical drawings are now contained in a
separate document, Package Mechanical Drawings, available on the Microsemi SoC
Products Group website.
Revision
Changes
Page
相關(guān)PDF資料
PDF描述
EEM24DTBS CONN EDGECARD 48POS R/A .156 SLD
RMC40DRYS-S734 CONN EDGECARD 80POS DIP .100 SLD
RAC05-3.3SA-ST CONV AC/DC 90-264VAC 3.3V 1.5A
BAS20LT1G DIODE SWITCH 200MA 200V SOT23
A3P1000-PQG208 IC FPGA 300I/O 208PQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX09-PQG100A 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PQG100I 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PQG100M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 100-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 100PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 83 I/O 100PQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP
A42MX09-PQG160 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PQG160A 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)