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參數(shù)資料
| 型號(hào)： | AD5025BRUZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 15/28頁(yè) |
| 文件大小： | 0K |
| 描述： | IC DAC DUAL 12BIT SPI 14TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Data Converter Fundamentals DAC Architectures |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | nanoDAC™ |
| 設(shè)置時(shí)間： | 5.8µs |
| 位數(shù)： | 12 |
| 數(shù)據(jù)接口： | 串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 13.5mW |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 14-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 14-TSSOP |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 輸出數(shù)目和類型： | 2 電壓，單極；2 電壓，雙極 |
| 采樣率（每秒）： | * |
| 其它名稱： | AD5025BRUZ-REEL7DKR |
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AD5025/AD5045/AD5065
Rev. 0 | Page 22 of 28
POWER-DOWN LOCKOUT
The AD5025/AD5045/AD5065 contain a digital input pin, PDL.
When activated, the power-down lockout pin (PDL) disables
software shutdown under any circumstances. The user should
hardwire the PDL pin to a logic low (thus preventing subsequent
software power-down) or logic high (the part can be placed in
power-down mode over the serial interface). If the user transitions
the PDL pin from logic high to a logic low during a valid write
sequence, the device responds immediately and the current
write sequence is aborted. Note the following PDL features.
PDL During a Write Sequence
If a PDL is generated (that is, a high-to-low transition) while a
valid write sequence is ongoing, the write is aborted. The user
must rewrite the current write command again.
PDL While DACs in Power-Down Mode
If a PDL is generated while the DAC(s) are in power-down
mode, the DAC(s) come out of power-down (that is, all power-
down bits are reset to 0000) to the last voltage output correspond-
ing to the last valid stored DAC value. While PDL remains active,
software power-down is disabled.
PDL Low to High Transition
After PDL is taken from a low to a high state, all DAC channels
remain in normal mode, and the user must reissue a software
power-down command to the control register to power down
the required channels.
Transitioning PDL from a low to a high disables the feature
immediately.
If PDL and CLR are generated at the same time, the CLR signal
causes the DAC register to change as per the clear code register,
and the DACs come out of power-down.
If PDL, CLR, and LDAC are generated at the same time, CLR
has higher precedence over LDAC and PDL.
The user is recommended to hardwire the pin to a logic high or
low, thereby either enabling or disabling the feature.
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the board.
The printed circuit board (PCB) containing the AD5025/AD5045/
AD5065 should have separate analog and digital sections. If the
AD5025/AD5045/AD5065 are in a system where other devices
require an AGND-to-DGND connection, the connection should
be made at one point only. This ground point should be as close
as possible to the AD5025/AD5045/AD5065.
Bypass the power supply to the AD5025/AD5045/AD5065 with
10 μF and 0.1 μF capacitors. The capacitors should physically be
as close as possible to the device, with the 0.1 μF capacitor
ideally right up against the device. The 10 μF capacitors are the
tantalum bead type. It is important that the 0.1 μF capacitor has
low effective series resistance (ESR) and low effective series
inductance (ESI), which is typical of common ceramic types of
capacitors. This 0.1 μF capacitor provides a low impedance path
to ground for high frequencies caused by transient currents due
to internal logic switching.
The power supply line should have as large a trace as possible to
provide a low impedance path and reduce glitch effects on the
supply line. Shield clocks and other fast switching digital signals
from other parts of the board by digital ground. Avoid crossover
of digital and analog signals if possible. When traces cross on
opposite sides of the board, ensure that they run at right angles
to each other to reduce feedthrough effects through the board.
The best board layout technique is the microstrip technique,
where the component side of the board is dedicated to the
ground plane only and the signal traces are placed on the solder
side. However, this is not always possible with a 2-layer board.
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