AD5570
Rev. C | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to AGND, AGNDS, DGND
0.3 V to +17 V
VSS to AGND, AGNDS, DGND
+0.3 V to 17 V
AGND, AGNDS to DGND
0.3 V to +0.3 V
REFGND to AGND, ADNDS
0.3 V to +0.3 V
REFIN to AGND, AGNDS
0.3 V to +17 V
REFIN to REFGND
0.3 V to +17 V
Digital Inputs to DGND
0.3 V to VDD + 0.3 V
VOUT to AGND, AGNDS
VSS 0.3 V to
VDD + 0.3 V
SDO to DGND
0.3 V to +6.5 V
Operating Temperature Range
W/Y Grades
40°C to +125°C
A/B Grades
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature (TJ max)
150°C
16-Lead SSOP Package
Power Dissipation
(TJ max – TA)/θJA
θJA Thermal Impedance
139°C/W
Lead Temperature (Soldering, 10 sec)
300°C
IR Reflow, Peak Temperature
230°C
5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
1 HBM classification.