AD5765
Data Sheet
Rev. C | Page 10 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 5.
Parameter
Rating
AVDD to AGNDx, DGND
0.3 V to +7 V
AVSS to AGNDx, DGND
+0.3 V to 7 V
DVCC to DGND
0.3 V to +7 V
DVCC to AVDD
DVCC to +0.25 V
Digital Inputs to DGND
0.3 V to DVCC + 0.3 V or 7 V
(whichever is less)
Digital Outputs to DGND
0.3 V to DVCC + 0.3 V
REFx to AGNDx, PGND
0.3 V to AVDD + 0.3 V
VOUTx to AGNDx
AVSS to AVDD
AGNDx to DGND
0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
Power Dissipation
(TJ max – TA)/θJA
Lead Temperature
JEDEC industry standard
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead TQFP
65
12
°C/W
ESD CAUTION