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參數(shù)資料
| 型號： | AD8139ARDZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 18/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP DIFF R-R LN LDIST 8SOIC |
| 標準包裝： | 1,000 |
| 放大器類型： | 差分 |
| 電路數(shù)： | 1 |
| 輸出類型： | 差分，滿擺幅 |
| 轉(zhuǎn)換速率： | 800 V/µs |
| -3db帶寬： | 410MHz |
| 電流 - 輸入偏壓： | 2.25µA |
| 電壓 - 輸入偏移： | 150µV |
| 電流 - 電源： | 24.5mA |
| 電流 - 輸出 / 通道： | 100mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 12 V，±2.25 V ~ 6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm Width）裸露焊盤 |
| 供應商設備封裝： | 8-SOIC-EP |
| 包裝： | 帶卷 (TR) |
AD8139
Rev. B | Page 24 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-012-A A
CONTROLLING DIMENSIONS ARE IN MILLIMETER; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
06
05
06-
A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.050)
0.40 (0.016)
0.50 (0.020)
0.25 (0.010)
45°
8°
0°
1.75 (0.069)
1.35 (0.053)
1.65 (0.065)
1.25 (0.049)
SEATING
PLANE
85
4
1
5.00 (0.197)
4.90 (0.193)
4.80 (0.189)
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
1.27 (0.05)
BSC
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
0.51 (0.020)
0.31 (0.012)
COPLANARITY
0.10
TOP VIEW
2.29 (0.090)
BOTTOM VIEW
(PINS UP)
2.29 (0.090)
0.10 (0.004)
MAX
Figure 65. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]
Narrow Body (RD-8-1)—Dimensions shown in millimeters and (inches)
0
61
50
7
-B
1
EXPOSED
PAD
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
Figure 66. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead (CP-8-2)—Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package
Option
Branding
AD8139ARD
–40°C to +125°C
8-Lead Small Outline Package with Exposed Pad (SOIC_N_EP)
RD-8-1
AD8139ARD-REEL
–40°C to +125°C
8-Lead Small Outline Package with Exposed Pad (SOIC_N_EP)
RD-8-1
AD8139ARD-REEL7
–40°C to +125°C
8-Lead Small Outline Package with Exposed Pad (SOIC_N_EP)
RD-8-1
AD8139ARDZ1
–40°C to +125°C
8-Lead Small Outline Package with Exposed Pad (SOIC_N_EP)
RD-8-1
AD8139ARDZ-REEL1
–40°C to +125°C
8-Lead Small Outline Package with Exposed Pad (SOIC_N_EP)
RD-8-1
AD8139ARDZ-REEL71
–40°C to +125°C
8-Lead Small Outline Package with Exposed Pad (SOIC_N_EP)
RD-8-1
AD8139ACP-R2
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_VD)
CP-8-2
HEB
AD8139ACP-REEL
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_VD)
CP-8-2
HEB
AD8139ACP-REEL7
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_VD)
CP-8-2
HEB
AD8139ACPZ-R21
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_VD)
CP-8-2
HEB#
AD8139ACPZ-REEL1
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_VD)
CP-8-2
HEB#
AD8139ACPZ-REEL71
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_VD)
CP-8-2
HEB#
1 Z = RoHS Compliant Part, # denotes RoHS product may be top or bottom marked.
2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04679-0-10/07(B)
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