參數(shù)資料
型號： AD9262BCPZRL7
廠商： Analog Devices Inc
文件頁數(shù)： 31/32頁
文件大?。?/td> 0K
描述： IC ADC 16BIT 2.5MHZ 64LFCSP
設(shè)計資源： Interfacing ADL5382 to AD9262 as an RF-to-Bits Solution (CN0062)
標(biāo)準(zhǔn)包裝： 750
位數(shù)： 16
采樣率（每秒）： 160M
數(shù)據(jù)接口： 串行，SPI?
轉(zhuǎn)換器數(shù)目： 2
功率耗散（最大）： 640mW
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 64-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 64-LFCSP-VQ（9x9）
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 2 個單端，雙極；1 個差分，單極
AD9262
Rev. A | Page 8 of 32
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DVDD to DGND
0.3 V to +2.0 V
DRVDD to DGND
0.3 V to +3.9 V
AGND to DGND
0.3 V to +0.3 V
AVDD to DRVDD
3.9 V to +2.0 V
CVDD to CGND
0.3 V to +2.0 V
CGND to DGND
0.3 V to +0.3 V
D0A to D15A to DGND
0.3 V to +2.0 V
D0B to D15B to DGND
0.3 V to +2.0 V
DCO to DGND
0.3 V to +2.0 V
ORA, ORB to DGND
0.3 V to +2.0 V
SDIO to DGND
0.3 V to +3.9 V
CSB to AGND
0.3 V to +3.9 V
SCLK to AGND
0.3 V to +3.9 V
VIN+A/VINA, VIN+B/VINB to AGND
0.3 V to +2.5 V
CLK+, CLK to CGND
0.3 V to +2.0 V
Environmental
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 Sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LFCSP (CP-64-4)
21.2
1.1
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
ESD CAUTION
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