Data Sheet
ADP5587
Rev. D | Page 23 of 24
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.25
0.20
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD-8.
0
7
2
8
0
9
A
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.20
2.10 SQ
2.00
Figure 21. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-10)
Dimensions shown in millimeters
0
9
2
0
9
-B
A
B
C
D
E
0.645
0.600
0.555
0.230
0.200
0.170
2.010
1.970 SQ
1.930
1
2
3
4
5
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.287
0.267
0.247
SEATING
PLANE
COPLANARITY
0.05
0.40
REF
1.60
REF SQ
0.022
REF
0.395
0.375
0.355
BALL A1
IDENTIFIER
Figure 22. 25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-4)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature
Range
I2C Write
Address
Package Description
Package
Option
Write
Read
ADP5587ACPZ-R7
40°C to +85°C
0x68
0x69
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-24-10
ADP5587ACPZ-1-R7
40°C to +85°C
0x60
0x61
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-24-10
ADP5587ACBZ-R7
40°C to +85°C
0x68
0x69
25-Ball Wafer Level Chip Scale Package [WLCSP]
CB-25-4
ADP5587CP-EVALZ
0x68
0x69
Evaluation Board [LFCSP_WQ]
CP-24-10
ADP5587CB-EVALZ
0x68
0x69
Evaluation Board [WLCSP]
CB-25-4
1
Z = RoHS Compliant Part.