VCC 0.3 V t" />
參數(shù)資料
型號: ADP5587ACBZ-R7
廠商: Analog Devices Inc
文件頁數(shù): 20/24頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER/KEYBRD CTRLR
產(chǎn)品變化通告: 8mm Carrier Tape Changes 28/Feb/2012
標(biāo)準(zhǔn)包裝: 1
類型: I²C 端口擴(kuò)展器
應(yīng)用: 移動(dòng)電話
安裝類型: 表面貼裝
封裝/外殼: 25-UFBGA,WLCSP
供應(yīng)商設(shè)備封裝: 25-WLCSP
包裝: 標(biāo)準(zhǔn)包裝
配用: ADP5587CP-EVALZ-ND - EVAL BOARD FOR ADP5587
其它名稱: ADP5587ACBZ-R7DKR
Data Sheet
ADP5587
Rev. D | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
VCC
0.3 V to + 4.0 V
R0 to R7, C0 to C9
0.3 V to VCC + 0.3 V
SCL
0.3 V to VCC + 0.3 V
SDA
0.3 V to VCC + 0.3 V
RST
0.3 V to VCC + 0.3 V
INT
0.3 V to VCC + 0.3 V
GND
0.3 V to +0.3 V
Operating Ambient Temperature Range
40°C to +85°C
Operating Junction Temperature Range
40°C to +125°C
Storage Temperature Range
65°C to +150°C
ESD Machine Model
±200 V
ESD Human Body Model
±2000 V
ESD Charged Device Model
±1000 V
Soldering Condition
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
24-Lead LFCSP_WQ
57.8
9.4
°C/W
Maximum Power
600
N/A
mW
25-Ball WLCSP
46
N/A
°C/W
Maximum Power
600
N/A
mW
ESD CAUTION
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