參數(shù)資料
型號(hào): ADSP-21061LKB-160
廠商: Analog Devices Inc
文件頁(yè)數(shù): 41/52頁(yè)
文件大?。?/td> 0K
描述: IC DSP CONTROLLER 32BIT 225BGA
產(chǎn)品培訓(xùn)模塊: SHARC Processor Overview
標(biāo)準(zhǔn)包裝: 1
系列: SHARC®
類型: 浮點(diǎn)
接口: 同步串行端口(SSP)
時(shí)鐘速率: 40MHz
非易失內(nèi)存: 外部
芯片上RAM: 128kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 3.30V
工作溫度: 0°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 225-BBGA
供應(yīng)商設(shè)備封裝: 225-PBGA
包裝: 托盤
Rev. D | Page 46 of 52 | May 2013
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21061 is available in 240-lead thermally enhanced
MQFP package. The top surface of the thermally enhanced
MQFP contains a metal slug from which most of the die heat is
dissipated. The slug is flush with the top surface of the package.
Note that the metal slug is internally connected to GND
through the device substrate.
The ADSP-21061L is available in 240-lead MQFP and 225-ball
plastic BGA packages.
All packages are specified for a case temperature (TCASE). To
ensure that the TCASE is not exceeded, a heatsink and/or an air-
flow source may be used. A heat sink should be attached with a
thermal adhesive.
TCASE = TAMB + (PD CA)
TCASE = Case temperature (measured on top surface of package)
TAMB = Ambient temperature C
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
CA =Value from tables below.
Table 29. ADSP-21061 (5 V Thermally Enhanced ED/MQFP
Package)
Parameter
Condition (Linear Ft./Min.)
Typical
Unit
CA
Airflow = 0
Airflow = 100
Airflow = 200
Airflow = 400
Airflow = 600
10
9
8
7
6
°C/W
Table 30. ADSP-21061L (3.3 V MQFP Package)
Parameter
Condition (Linear Ft./Min.)
Typical
Unit
CA
Airflow = 0
Airflow = 100
Airflow = 200
Airflow = 400
Airflow = 600
19.6
17.6
15.6
13.9
12.2
°C/W
Table 31. ADSP-21061L (3.3 V PBGA Package)
Parameter
Condition (Linear Ft./Min.)
Typical
Unit
CA
Airflow = 0
Airflow = 200
Airflow = 400
19.0
13.6
11.2
°C/W
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